WMSIC Electronic Components

PANJIT ZMM55-C15_R1_10001 ZMM55

ModelZMM55-C15_R1_10001
PackageMiniMELF
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT ZMM55-C15_R1_10001
Type
PANJIT
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
ZMM55-C15_R1_10001
Electronic Component
1
Package
MiniMELF
Electronic Component
Zener Diode
Electronic Component
0.051g
Electronic Component
1
(Zzk)
110Ω
(Zzt)
30Ω
Electronic Component
BM0266087803
Diode
1
Current(Ir)
100nA@11V
Power Dissipation(Pd)
500mW
Electronic Component
13.8V~15.6V
Electronic Component
65℃~+175℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZMM55-C15_R1_10001 产品概述

一、产品简介

ZMM55-C15_R1_10001 是强茂(PANJIT)出品的一颗高可靠性 MiniMELF 结构的稳压二极管(齐纳/稳压管),为单只独立式器件,标称稳压值为 15V。器件设计兼顾低漏电和稳定的稳压特性,适用于空间受限且对基准电压稳定性有要求的电子系统。

二、主要电气参数

  • 稳压值(标称):15V
  • 稳压范围:13.8V ~ 15.6V
  • 反向电流 Ir:100 nA @ 11V(低漏电设计)
  • 耗散功率 Pd:500 mW(在规定环境与散热条件下)
  • 小信号阻抗 Zzt:30 Ω
  • 倍频/拐点阻抗 Zzk:110 Ω
  • 工作结温范围:-65 ℃ ~ +175 ℃
  • 封装:MiniMELF(玻璃/金属筒型),品牌:PANJIT

三、典型特性与优势

  • 稳压精度好:标称 15V,实测稳压范围在 13.8–15.6V,适合对电压基准要求较高的应用。
  • 低漏电流:在 11V 时反向漏电仅 100nA,有利于低功耗系统或高阻抗输入场景。
  • 良好的阻抗特性:Zzt(30Ω)与 Zzk(110Ω)表明在工作区内具有较低的小信号阻抗,从而提升稳压性能与瞬态响应。
  • 宽温度适应性:工作结温可覆盖 -65℃ 到 +175℃,适应汽车级、工业级及极端环境应用。
  • MiniMELF 封装:体积小、引线电感低,有利于高频性能及 SMT/波峰焊混合工艺。

四、推荐应用场景

  • 参考电压源与低成本稳压模块。
  • 电平转换与电压钳位、保护输入(限压、过压钳位)。
  • 工业控制、汽车电子与通讯设备中对稳压与温度范围有较高要求的分立稳压方案。
  • 仪表、传感器前端的基准电压或保护电路,尤其在需兼顾低漏电的场合更为合适。

五、使用注意与热管理

  • 耗散功率 Pd 为 500 mW,使用时需按实际环境与PCB散热条件进行功率限流与降额设计。建议在较高结温下对允许功率进行线性降额处理,避免长期在额定功率下运行。
  • 推荐与串联限流电阻配合使用以设定稳压电流,保证器件工作在稳压区;在冲击电流或浪涌场合需加保护元件。
  • MiniMELF 封装对机械应力敏感,焊接与清洗工艺需遵循厂商推荐的温度曲线与时间限制,避免长时间高温暴露。
  • ESD 与反向极性保护:尽管器件耐压特性良好,仍建议在电路中加入必要的防静电与反接保护措施以提高可靠性。

六、封装、可靠性与采购建议

  • 封装:MiniMELF,适用于通孔与自动化装配要求较高的设计。
  • 品牌与质量:PANJIT(强茂)出品,适合需要稳定供应与工业级可靠性的项目。
  • 选型提示:若电压精度或漏电指标有更严格要求,可参照数据手册选择对应公差等级或高功率型号;若应用需更高功率或更低阻抗,考虑更大耗散能力或并联/替代方案。
  • 订购信息:器件型号 ZMM55-C15_R1_10001,购买时请确认批次与出厂测试条件,必要时索取详细数据手册与样片进行电路验证。

如需本型号的完整典型曲线(I–V 曲线、温度漂移、阻抗随电流变化等)或焊接/热仿真建议,我可以帮您整理或与实际应用参数一并对照验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.