WMSIC Electronic Components

PANJIT PJA3404_R1_00001

ModelPJA3404_R1_00001
PackageSOT-23
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT PJA3404_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
PJA3404_R1_00001
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.017g
Electronic Component
1
Electronic Component
BM0227252340
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.25W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PJA3404_R1_00001 产品概述

一、产品简介

PJA3404_R1_00001 是强茂(PANJIT)出品的一颗 SOT-23 封装 N 沟道场效应晶体管(MOSFET)。该器件额定漏源电压为 30V,连续漏极电流 5.6A,导通电阻典型值为 45mΩ(VGS=4.5V),功耗(耗散功率)为 1.25W。器件适用于低压电源管理与开关场景,兼顾低导通损耗与较小的体积封装,适合便携、通信与消费类电子等应用。

二、主要参数一览

  • 类型:N 沟道 MOSFET
  • 封装:SOT-23(单颗,表面贴装)
  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:5.6A
  • 导通电阻 RDS(on):45mΩ @ VGS=4.5V
  • 耗散功率 Pd:1.25W
  • 阈值电压 VGS(th):2.1V @ ID=250µA
  • 总栅电荷 Qg:7.8nC @ VGS=10V
  • 输入电容 Ciss:343pF;输出电容 Coss:48pF;反向传输电容 Crss:34pF
  • 工作温度范围:-55℃ ~ +150℃
  • 品牌:PANJIT(强茂)

三、性能与特点

  • 逻辑电平驱动友好:RDS(on) 在 VGS=4.5V 下给出,便于直接由常见 MCU/驱动器控制。
  • 低导通损耗:45mΩ 的低阻抗在中小电流应用中能有效降低导通损耗与发热。
  • 中等开关速度:较小的 Ciss/Crss 与 Qg=7.8nC,使其在中速开关场景(DC-DC、降压转换、功率开关)表现平衡。
  • 宽温度适应:-55℃ 至 +150℃ 的工作范围适合工业与环境敏感产品。

四、典型应用场景

  • 低压电源开关与保护(负载开关、背靠背保护)
  • DC-DC 降压转换器低侧开关
  • 电池管理电路与便携设备电源路径控制
  • 小功率电机驱动、继电器驱动的低侧开关
  • 通信设备与消费电子的功率管理模块

五、实用建议与注意事项

  • 驱动设计:若要求高速切换或在高频电路中使用,需考虑栅极驱动能力,Qg=7.8nC 在 10V 驱动时需要相应驱动电流;在 VGS=4.5V 下已达到标称 RDS(on)。
  • 热管理:SOT-23 封装的 Pd=1.25W 为典型条件下的功耗限制,实际系统中应通过 PCB 大面积铜箔、散热孔或铺铜层提升散热能力,避免长期在高电流下超温。
  • 布局与寄生抑制:尽量缩短漏-源主回路走线,增大散热区与地铜,栅极串联 10–100Ω 阻尼可抑制振铃,门到源并联 100kΩ 级的泄放电阻可防止误触发。
  • 浪涌与保护:在存在大瞬态或反向电压时,应配合 TVS、肖特基二极管或 RC 吸收网络以保护器件。
  • 引脚与封装:SOT-23 引脚定义会因封装变体而异,设计前请严格参照器件数据手册与封装图纸,确认引脚排列与焊盘尺寸。

六、总结

PJA3404_R1_00001 以其 30V 耐压、低 RDS(on) 与 SOT-23 小尺寸封装,适合用于空间受限且要求低导通损耗的电源管理与开关场景。合理的栅极驱动与 PCB 热设计可以充分发挥其性能,使其在便携设备与工业控制等领域成为经济且可靠的选择。若需更详细的电气特性曲线、引脚图与热阻信息,请参考厂商正式数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.