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PANJIT RB521S30_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT RB521S30_R1_00001
- Type
- PANJIT
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- RB521S30_R1_00001
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.016g
- Electronic Component
- 1
- Electronic Component
- BM0227276485
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 100uA@30V
- (Vf)
- 500mV@200mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB521S30_R1_00001 产品概述
一 产品简介
RB521S30_R1_00001 是强茂（PANJIT）推出的一款小尺寸肖特基整流二极管，采用 SOD-523 封装，面向空间受限且需要低压降、高速整流的便携式与消费电子应用。其典型正向压降为 0.5V（在 200mA 条件下），兼顾低功耗与较好的开关性能。
二 主要参数
- 型号：RB521S30_R1_00001（PANJIT / 强茂）
- 封装：SOD-523（超小型表贴）
- 正向压降 Vf：0.5V @ IF=200mA
- 最大整流电流 IF(AV)：200mA
- 直流反向耐压 VR：30V
- 反向漏电流 IR：100µA @ VR=30V
三 特性与优势
- 低正向压降：在中小电流范围内降低功耗与发热，适合低电压电源整流与轨电压保护。
- 快速开关：肖特基结构使恢复时间极短，适用于高频整流与开关电源末级整流。
- 小型封装：SOD-523 占板面积小，适合高密度 PCB 设计与便携设备。
- 品牌与质量：强茂为成熟半导体厂商，产品适配量产 SMT 流程，符合 RoHS 要求（请参考完整数据手册确认认证信息）。
四 典型应用
- 移动电源、智能手表、蓝牙耳机等便携式电源整流与反向保护；
- 开关电源次级整流、肖特基钳位电路、高频整流场合；
- 信号路径保护、保护二极管、低压快速恢复整流。
五 封装与热管理
SOD-523 为超小表贴封装，散热能力有限。尽管额定整流电流为 200mA，长时间或高环境温度下应注意降额使用，必要时在 PCB 设计中加大铜箔散热或并联使用更大封装的器件以降低结温。
六 使用建议与注意事项
- 设计时考虑反向漏电流随温度上升显著增加，在高温环境下对待电池待机或待机电流敏感的电路需评估 IR 的影响；
- 瞬态冲击电流建议通过限流电阻或电路保护措施控制；
- 推荐在 PCB 布局时为二极管预留足够焊盘并在需要处添加热扩散铜箔，提高可靠性；
- 详细电气特性、热阻与可靠性指标以厂商数据手册为准，选型前请索取并确认完整规格书。
若需完整数据表、封装图或量产采购信息，可联系供应商或强茂官方渠道获取更详尽的技术资料与样品支持。
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