WMSIC Electronic Components

PANJIT BZX84C3_R1_00001

ModelBZX84C3_R1_00001
PackageSOT-23
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT BZX84C3_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
BZX84C3_R1_00001
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.02g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
95Ω
Electronic Component
BM0227640124
Diode
1
Current(Ir)
10uA@1V
Power Dissipation(Pd)
200mW
Electronic Component
2.85V~3.15V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C3_R1_00001 产品概述

一、产品简介

BZX84C3_R1_00001 是强茂(PANJIT)生产的一款低功耗稳压二极管(Zener Diode),标称稳压值为 3V,采用 SOT-23 小封装设计。该器件适用于对空间和功耗有严格限制的便携式与低功耗电子设备中,常用作基准稳压、保护钳位与偏置源等场合。

二、主要电气参数

  • 标称稳压(Vz):3V
  • 反向电流(Ir):10 μA @ 1V(在反向 1V 时的泄漏电流)
  • 耗散功率(Pd):200 mW(最大耗散功率)
  • 动态阻抗(Zzt):95 Ω(表征小信号下伏安曲线的斜率)

这些参数表明该型号为低功耗、低电流等级的稳压器件,适合用于微安到数十毫安范围内的稳压与钳位应用。

三、性能与使用要点

  1. 功率与电流限制:在最大耗散功率 200 mW 下,理论上在 3V 稳压点的最大稳压电流约为 66 mA(Iz_max ≈ Pd / Vz)。但由于 SOT-23 的散热受限,实际设计中应显著降额使用以保证长期可靠性,建议在典型设计中将平均工作电流控制在远低于此值的水平,并使用串联限流电阻限制冲击电流。
  2. 动态阻抗影响稳压精度:Zzt = 95 Ω 表明在小电流区器件的动态阻抗较大,稳压精度随电流波动会明显变化。若对电压精度要求较高,应在较稳定的偏流点(通常为几毫安级或参考厂家曲线)工作或采用后端补偿手段。
  3. 反向漏电:Ir 在 1V 时为 10 μA,表示在低反向偏压下漏电较小,适合用于低功耗电路和电池供电系统。但在高温条件下漏电会增大,需在热设计中考虑温度影响。

四、典型应用场景

  • 低压参考与基准电压源(便携设备中的分立参考)
  • 信号线或电源的浪涌/过压钳位保护
  • 晶体管偏置或放大器偏置网络中的稳定电压源
  • 低功耗传感器与监测电路中的温度/电压保护元件
  • 小型模拟电路中用于电压整定与漂移补偿

五、封装与布板建议

该器件为 SOT-23 封装,体积小、易于表面贴装。由于封装散热能力有限,建议在 PCB 布局时采取以下措施以改善热性能与可靠性:

  • 在焊盘下方或附近增加铜箔面积作为散热通道;
  • 为可能的较高功率耗散预留热沉或多层铜铺铜;
  • 串联限流电阻设置合理阻值,以限制稳压二极管的功率损耗;
  • 注意封装极性与布线,避免与敏感模拟节点过近而引入噪声。

六、选型与可靠性建议

  • 若设计对稳压精度或低噪声有较高要求,建议选用动态阻抗更低或额定功率更高的稳压器件,或采用专用基准芯片。
  • 在高温、连续偏流或脉冲冲击环境下,应按厂商推荐的降额系数设计,以保证长期寿命。
  • 对湿敏度和回流焊工艺,遵循 SOT-23 常见的工业标准及厂商的储存/回流建议,避免受潮或超出温度曲线。

七、总结

BZX84C3_R1_00001(PANJIT)是一款面向低功耗、小体积应用的 3V 稳压二极管,适用于便携式与低电流场景的基准稳压与过压钳位。其 200 mW 的耗散能力和 95 Ω 的动态阻抗决定了该器件在电流与热管理上需谨慎设计——通过合理限流、PCB 散热优化与降额使用,可以在诸多小型电子设备中实现稳定可靠的工作表现。购买与具体电气特性、温度特性以及曲线信息,请参阅强茂(PANJIT)详细数据手册以获取完整测试条件与参考曲线。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.