Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT BZD27C5V6P_R1_00001
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT BZD27C5V6P_R1_00001
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- BZD27C5V6P_R1_00001
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Zener Diode
- Electronic Component
- 0.035g
- Electronic Component
- 1
- (Zzt)
- 4Ω
- Electronic Component
- BM0264240995
- Diode
- 1
- Current(Ir)
- 10uA@2V
- Power Dissipation(Pd)
- 800mW
- Electronic Component
- 5.38V~5.82V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZD27C5V6P_R1_00001 产品概述
一、产品简介
BZD27C5V6P_R1_00001 是 PANJIT（强茂）推出的一款独立式稳压二极管（Zener），标称稳压值 5.6V，实际稳压范围为 5.38V ～ 5.82V。器件为单体设计，适用于表面贴装工艺，封装形式为 SOD-123FL，适合空间受限且要求自动化贴装的场合。
二、主要电气参数
- 标称稳压：5.6V（稳压范围 5.38V ～ 5.82V）
- 反向电流 Ir：10 μA @ 2V（低电流下的反向泄漏较小）
- 交流阻抗 Zzt：4 Ω（低动态阻抗有利于较好稳压性能）
- 最大耗散功率 Pd：800 mW（在规定散热条件下）
- 工作结温范围：-55 ℃ ～ +150 ℃
三、封装与机械特性
SOD-123FL 小型化表面贴装封装，适用于中小功率稳压与保护场合。封装尺寸兼顾散热与占板面积，支持高速贴片及回流焊工艺。包装有利于自动化生产线的应用。
四、典型应用场景
- 低功耗电源的基准与稳压（偏置电压、参考源）
- 输入电压浪涌或瞬态时的电压钳位与保护
- 模拟电路或数字电路的偏置与稳定供电点
- 消费电子、通信设备、工业控制等需要稳压保护的模块
五、设计与使用注意
- 最大允许电流（理论估算）：Imax ≈ Pd / Vz = 0.8 W / 5.6 V ≈ 143 mA。实际应参考电路板散热条件并适当留有余量，不建议长期在此极限工作点运行。
- 串联限流电阻设计示例：若 Vin = 12 V，目标 Zener 电流 Iz = 20 mA，则 R = (12 − 5.6) / 0.02 ≈ 320 Ω；此时二极管耗散功率约 5.6 × 0.02 = 0.112 W，远低于 Pd。
- 在高温环境下需按厂家热阻与温度系数进行功率降额处理，避免结温超过 150 ℃。
- 低电流区（如微安级）泄漏电流为设计参考值，应在设计中考虑对微弱电流的影响。
六、可靠性与封装注意事项
- 器件工作温度范围宽，适合工业级应用。
- 采用标准回流焊工艺时，请参考 PANJIT 的回流曲线与湿热、焊接规范，避免过热或长时间高温暴露影响长期可靠性。
- 建议在 PCB 布局时为封装留出合理铜箔散热区域，以提高功率耗散能力。
七、订购与识别
型号：BZD27C5V6P_R1_00001，品牌：PANJIT（强茂），封装：SOD-123FL。订购时请确认完整规格、批次与质量认证需求，并与供应商确认装带方式与最低起订量。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
