WMSIC Electronic Components

PANJIT BZX84C43_R1_00001

ModelBZX84C43_R1_00001
PackageSOT-23
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT BZX84C43_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
BZX84C43_R1_00001
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
375Ω
(Zzt)
150Ω
Electronic Component
BM0264356040
Diode
1
Power Dissipation(Pd)
410mW
Electronic Component
40.85V~45.15V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C43_R1_00001 产品概述

① 概览

BZX84C43_R1_00001 是 PANJIT(强茂)推出的一款小功率稳压二极管,封装为常见的 SOT-23。标称稳压值为 43V,适用于低功耗电压基准、过压保护与电平钳位等应用场景。器件以其紧凑体积和可靠的温度范围(-55℃ ~ +150℃)适合空间受限的表贴电路板设计。

② 主要电性能参数

  • 标称稳压值:43V;实测稳压范围:40.85V ~ 45.15V(对应约 ±5% 公差);
  • 反向电流 Ir:100nA @ 30.1V(表示在较低偏压下的漏电行为,体现了器件在静态条件下的低泄漏特性);
  • 最大耗散功率 Pd:410mW(器件在允许的散热条件下的最大结点耗散);
  • 动态阻抗 Zzt:150Ω(稳压区的动态/交流阻抗,影响纹波抑制和负载调节);
  • 拐点阻抗 Zzk:375Ω(低电流或拐点区域的阻抗,表明在微小电流下稳压能力下降);
  • 工作结温范围:-55℃ ~ +150℃,满足工业级温度要求。

③ 应用场景

  • 作高电压低功耗电压基准或简单稳压源(小电流场合);
  • 作为输入端的过压保护或电压钳位元件,保护下游电路免受瞬态高压冲击;
  • 在模拟电路中用于参考电压、偏置网络或噪声容忍要求不高的场合;
  • 适用于便携式设备、消费电子、工业控制等需兼顾体积与成本的系统。

④ 封装与热管理要点

SOT-23 封装体积小,便于高密度贴装,但散热能力有限。410mW 为器件最大耗散,实际应用中应考虑到环境温度、PCB 铜箔面积及散热路径,建议对 Pd 进行适当降额并参照厂商完整数据手册中的热阻 RθJA 数据进行设计,必要时增加散热铜箔或改变布局以提高可靠性。

⑤ 设计与选型建议

  • 若用于稳压参考,应通过限流电阻设置合适工作电流并保证在稳压区域(参考动态阻抗 Zzt)工作;
  • 对于精密参考场合,此类稳压二极管受温度漂移和容差限制,建议采用专用低漂移参考源;
  • 在高脉冲或高功率情况下,考虑更大耗散能力的器件或使用有源稳压方案;
  • 注意反向漏电 Ir 在高阻抗测量或微安级电路中的影响,必要时选择漏电更低的型号。

⑥ 小结

BZX84C43_R1_00001 提供了 43V 的稳压基准与小型封装的便利性,适合体积受限且功耗要求较低的稳压、保护或偏置应用。正确评估功耗、热设计与工作电流区间,能确保器件在实际电路中稳定可靠地发挥作用。若需更高精度或更大功耗能力,应考虑其他规格器件或参考 PANJIT 完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.