WMSIC Electronic Components

PANJIT MMSZ4692-V_R1_00001 MMSZ4692

ModelMMSZ4692-V_R1_00001
PackageSOD-123
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MMSZ4692-V_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MMSZ4692-V_R1_00001
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0264240994
Diode
1
Current(Ir)
10uA
Power Dissipation(Pd)
500mW
Electronic Component
6.46V~7.14V
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ4692-V_R1_00001 产品概述

一、产品简介

MMSZ4692-V_R1_00001 是 PANJIT(强茂)出品的一款独立式稳压二极管,标称稳压值为 6.8V,适用于需要小功率精密基准或过压/钳位保护的场合。器件采用 SOD-123 小封装,体积小、散热和布局方便,适合贴片工艺与密集线路板设计。

二、主要性能和参数

  • 稳压值(标称):6.8V
  • 稳压值(范围):6.46V ~ 7.14V(器件一致性与工艺公差)
  • 反向电流 Ir:典型 10 µA(制造商提供的参考测试条件,实际电流随反向电压与温度变化)
  • 耗散功率 Pd:500 mW(在推荐散热条件下)
  • 工作结温范围:-50 ℃ ~ +150 ℃
  • 封装:SOD-123(表面贴装)
    此器件为低功率稳压二极管,适合在小电流条件下提供稳定的参考电压或实现简单的电压钳位。

三、封装与机械特性

SOD-123 封装具有体积小、重量轻、易于自动贴装和回流焊接的优点,适合消费电子、移动设备和小型电源模块。封装热阻相对较高,使用时需注意芯片整体热管理和工作电流的限制,避免长期在接近 Pd 的条件下工作以延长寿命。

四、典型应用场景

  • 小功率稳压参考:为模拟电路或 ADC 提供稳定的基准电压(在限制电流条件下)。
  • 过压保护与钳位:对输入端或敏感节点提供简单可靠的电压钳位保护。
  • 传感器和便携式设备:体积受限、功耗要求低的场合。
  • 电平转换与偏置电路:在无须复杂稳压器的低成本方案中应用。

五、应用建议与注意事项

  • 选择合适的限流电阻:稳压二极管通常需要串联电阻限制工作电流。计算时应考虑最大耗散功率 Pd 和预计环境温度,确保在最恶劣条件下二极管功耗不超过 500 mW。
  • 考虑温度漂移:稳压值随结温变化,长期精密参考应配合温度补偿或选择更高精度方案。
  • 避免长期满功率工作:若需持续较大电流输出,建议使用功率裕量更高的器件或外加散热措施。
  • 焊接与存储:遵循 SMD 回流焊工艺规范,避免过热;存储环境避免潮湿以防封装吸湿引起焊接问题。

六、订购信息与品牌保障

产品型号:MMSZ4692-V_R1_00001;品牌:PANJIT(强茂);封装:SOD-123。购买时请向正规代理或分销商索取完整 datasheet 与原厂型号确认,确认测试条件(如 Ir 的测量电压与温度)以便在设计中正确使用。PANJIT 提供专业质量控制与出货检验,可满足一般商用与工业级应用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.