WMSIC Electronic Components

PANJIT MMSZ5246B_R1_00301

ModelMMSZ5246B_R1_00301
PackageSOD-123
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MMSZ5246B_R1_00301
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MMSZ5246B_R1_00301
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
17Ω
Electronic Component
BM0264484553
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
500mW
Electronic Component
15.2V~16.8V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ5246B_R1_00301 产品概述

一、简介

MMSZ5246B_R1_00301 是强茂(PANJIT)推出的一款高可靠性小功率稳压二极管,标称稳压值为 16V,采用平面芯片结构并封装于 SOD-123 表面贴装封装。器件设计用于小功率稳压和电压钳位场合,兼顾自动化贴装和环保要求,适合现代电子制造工艺。

二、主要电气参数与含义

  • 稳压值(标称):16V,规定范围 15.2V ~ 16.8V,适合需要 16V 参考或钳位点的电路。
  • 最大耗散功率 Pd:500mW。在 25℃ 条件下,器件最大通过的稳压电流 Iz(max) ≈ Pd / Vz = 0.5W / 16V ≈ 31.25mA,实际使用时应留有裕量并考虑温度降额。
  • 反向漏电流 Ir:100nA,低漏电流有利于提高低电源电流环境下的稳压精度。
  • 阻抗:Zzt = 17Ω(测试点小信号阻抗),有利于在工作电流附近获得较好稳压性能;Zzk = 600Ω(低电流台阶阻抗),影响器件在微小电流时的“膝点”特性。
  • 工作结温范围:-55℃ ~ +150℃,适应宽温度环境要求。

三、封装与工艺优势

SOD-123 小外形封装便于高密度 PCB 设计和自动化贴装流程,平面芯片结构使器件具有良好的批量一致性。符合欧盟 RoHS 2.0 的无铅规范,并采用符合 IEC 61249 标准的绿色模塑材料,满足环保与可靠性要求。

四、热管理与使用建议

尽管器件标称 Pd 为 500mW,但实际使用应注意以下几点:

  • 避免长期在最大耗散功率下工作,推荐留有安全裕度并根据实际环境温度降额使用。
  • PCB 布局时可通过增加焊盘/铜箔面积改善散热,短走线并靠近接地或电源大铜箔以降低结-环境热阻。
  • 外加串联限流电阻时,按 R = (Vin - Vz) / Iz 计算,且 Iz 不应超过 Iz(max)。在瞬态或脉冲情况下注意峰值功耗。

五、典型应用场景

  • 低功耗电路的参考稳压与基准电源
  • 电源线的过压钳位与瞬态保护(在合理功率范围内)
  • 模拟与数字系统中的电压基准、偏置网络
  • 工业控制、消费电子及通信设备中需 16V 稳压的局部电路

六、订购信息与合规性

品牌:PANJIT(强茂);封装:SOD-123;型号:MMSZ5246B_R1_00301。器件为 RoHS 2.0 无铅产品,绿色模塑材料符合 IEC 61249。购买与设计时请参考厂家完整数据手册获取更详细的电气特性曲线、最大额定值及推荐焊接工艺参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.