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PANJIT MMSZ5252B_R1_00301
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT MMSZ5252B_R1_00301
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- MMSZ5252B_R1_00301
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 33Ω
- Electronic Component
- BM0264772485
- Diode
- 1
- Current(Ir)
- 100nA@18V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 22.8V~25.2V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ5252B_R1_00301 产品概述
一、产品概述
MMSZ5252B_R1_00301 为 PANJIT（强茂）出品的独立式稳压二极管，标称稳压值 24V，采用平面芯片结构，封装为 SOD-123。器件设计用于小功率稳压与基准场合，既适合自动化贴装与回流焊工艺，也满足无铅、绿色材料的环境要求（符合 RoHS 2.0 与 IEC 61249）。
二、主要电气参数
- 标称稳压：24V（允许范围 22.8V ~ 25.2V）
- 反向电流 Ir：100 nA @ 18V（低漏电流特性，有利于高阻抗参照）
- 耗散功率 Pd：500 mW（在规定散热条件下）
- 动态阻抗 Zzt：33 Ω；静态阻抗 Zzk：600 Ω（在厂家测试条件下测得，用于评估稳压噪声与负载影响）
- 工作结温：-55 ℃ ~ +150 ℃
三、热性能与可靠性要点
500 mW 的耗散能力要求在电路布局时考虑散热：通过增加焊盘铜箔面积与靠近散热铜地，能有效降低结温并提升长期可靠性。高温环境下应按厂方给出的功率降额曲线使用，避免长期在极限功耗下工作以防寿命下降。
四、封装与装配特性
SOD-123 小型表贴封装，适配自动化贴装与回流焊流程。器件为无铅绿色模塑，适合现代电子制造对环保与可焊性要求。建议参考厂家封装尺寸和焊盘建议，以保证焊接可靠性与热性能。
五、典型应用场景与选型建议
适用于电源参考、基准稳压、偏置及保护回路等场合，尤其适合对稳压精度和低漏电要求较高的便携或工业设备。选型时注意系统允许的最大热功耗、工作环境温度以及负载变动带来的动态阻抗影响；若需更低噪声或更高功率，应考虑其他等级的稳压器件或外部散热方案。
六、使用与存储注意事项
建议遵循厂方回流焊温度曲线与 ESD 保护规范，避免长时间暴露在潮湿或超高温环境。出货前请参照完整规格书以获取测试条件、降额曲线及焊接建议，确保在目标应用中的性能与可靠性。
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