WMSIC Electronic Components

PANJIT MMSZ5254B_R1_00301

ModelMMSZ5254B_R1_00301
PackageSOD-123
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MMSZ5254B_R1_00301
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MMSZ5254B_R1_00301
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
41Ω
Electronic Component
BM0264878186
Diode
1
Current(Ir)
100nA@21V
Power Dissipation(Pd)
500mW
Electronic Component
25.65V~28.35V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ5254B_R1_00301 产品概述

一、产品简介

MMSZ5254B_R1_00301 为 PANJIT(强茂)出品的独立式稳压(齐纳)二极管,采用 SOD-123 小型外形封装,标称稳压值 27V。器件针对中低功率稳压、基准源及过压钳位场景设计,具有体积小、漏电低与温度范围宽的特点,适合集成电路外围保护及小型电源模块中作简单稳压元件。

二、主要参数

  • 稳压值(标称):27V(允许范围 25.65V ~ 28.35V)
  • 反向电流 Ir:100nA @ 21V(低漏电)
  • 最大耗散功率 Pd:500mW
  • 动态阻抗 Zzt:41Ω
  • 膝部阻抗 Zzk:600Ω
  • 工作结温:-55℃ ~ +150℃
  • 二极管配置:1 个独立式;封装:SOD-123

三、关键特性解读

Zzt(41Ω)表征在规定测试电流下的小信号动态阻抗,数值较低时稳压性能更佳;Zzk(600Ω)反映在低电流区靠近膝部的阻抗特性,数值较高表示在非常小的偏置电流时稳压起始相对陡峭。Ir 非常小,利于高阻抗电路的偏置与参考应用。500mW 的耗散能力适合小电流稳压与钳位,非用于大功率稳压。

四、典型应用

  • 作为 27V 参考/钳位源用于传感器供电与接口保护
  • 输入浪涌或瞬态过压保护(配合限流电阻或阻尼元件)
  • 电路基准、偏置网络中用于限制上限电压
  • 便携设备与通信模块中的高电压小电流稳压器

五、使用建议与热管理

  • 在环境温度 25℃ 下理论最大稳压电流约为 Iz_max ≈ Pd / Vz ≈ 500mW / 27V ≈ 18.5mA;若电流接近该值须注意结温上升并做好热设计。
  • 频繁或长期接近 Pd 工作会缩短寿命,应在 PCB 上增加铜箔散热、避免封装高温区;并按厂家热阻和功率温度降额曲线进行设计。
  • 施工与回流焊遵循 SOD-123 焊接规范,避免超过最大结温;存储与使用时注意湿度敏感等级(MSL)与静电防护。

六、封装与采购提示

SOD-123 小型封装利于高密度贴装与自动化生产,订购时请确认完整料号(MMSZ5254B_R1_00301)、出厂检验与包装形式,以便于生产匹配。选型时若需更严格稳压精度或更高功率,应考虑其他系列或通过并联、散热改进等方案提升能力。

如需基于该器件的电路例子(限流电阻计算、稳压性能曲线或 PCB 布局建议),可提供工作电压与负载条件,我将给出针对性的设计建议。

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