WMSIC Electronic Components

PANJIT SBM260VAL_R1_00001

ModelSBM260VAL_R1_00001
PackageSOD-123FL
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT SBM260VAL_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
SBM260VAL_R1_00001
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264795506
Current
2A
Diode
1
Current(Ir)
50uA@60V
(Vf)
540mV@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SBM260VAL_R1_00001 产品概述

一、产品简介

SBM260VAL_R1_00001 是强茂(PANJIT)推出的一款 60V Schottky 整流二极管,采用 SOD-123FL 小封装,单只独立器件。该器件面向需要低正向压降与快速整流响应的中小电流电源应用,直流整流电流额定为 2A,具备良好的浪涌承受能力与宽温度工作范围,适合消费电子、电源模块和通讯设备等场景使用。

二、主要性能参数

  • 正向压降 (Vf):540 mV @ 2A(典型条件)
  • 直流反向耐压 (Vr):60 V
  • 直流整流电流:2 A
  • 非重复峰值浪涌电流 (Ifsm):50 A
  • 反向电流 (Ir):50 μA @ 60 V
  • 工作结温范围:-55 ℃ ~ +150 ℃

这些参数表明器件在中等电流输出与冲击浪涌条件下具有可靠的整流与保护能力,同时保持较低的导通损耗,提升系统效率。

三、封装与热特性

SBM260VAL_R1_00001 采用 SOD-123FL 封装,体积小、适合高密度 PCB 布局。SOD-123FL 在空间受限的电路板上能够提供良好的焊接可靠性。尽管该封装散热能力有限,建议在高电流或高功率损耗的应用中采用充足的铜箔散热面积和过孔(vias)导热,以降低结温并延长器件寿命。

四、典型应用

  • 开关电源整流(尤其是低压输出侧)
  • DC-DC 降压转换器输出整流
  • 反向保护与防逆充电电路
  • 电池充放电路径控制
  • 通信设备、家电电源与便携设备的整流与保护

Schottky 结构的低正向压降特性,能有效降低整流损耗,提升转换效率,尤其适合对效率和发热敏感的场合。

五、设计要点与注意事项

  1. 反向漏电随温度升高显著增加:尽管室温下 Ir 为 50 μA@60 V,若工作在高温环境需考虑漏电上升对静态功耗与热量的影响,并在系统级进行热流管理与余量设计。
  2. 封装散热限制:在接近 2A 连续工作时,应优化 PCB 热路径(扩大焊盘、接地/电源铜箔和多孔导热),避免结温超限。
  3. 浪涌能力利用:Ifsm=50A 允许短时冲击电流,但不宜作为长期过载手段,应配合熔丝或限流措施防止重复冲击造成损伤。
  4. 焊接工艺:遵循 SOD-123FL 的回流曲线和焊盘设计规范,避免过热或焊接应力导致可靠性下降。

六、可靠性与选型建议

SBM260VAL_R1_00001 在宽温范围与充足浪涌裕度下,适合多数中功率整流场景。选型时应结合系统最大工作电压、连续电流与环境温度进行热仿真与退化裕度评估。若应用对反向漏电或更低 Vf 有极高要求,可考虑更大封装或低漏型 Schottky 器件;若需更高耐压则选择更高 Vr 等级的替代型号。

注:本文所列关键参数基于器件标称值,具体电气特性与环境测试结果请参阅 PANJIT 官方规格书(Datasheet)与样品验证,以获得最终设计确认。

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