Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT MMSZ5255B_R1_00301
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT MMSZ5255B_R1_00301
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- MMSZ5255B_R1_00301
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 44Ω
- Electronic Component
- BM0264544578
- Diode
- 1
- Current(Ir)
- 100nA@21V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 26.6V~29.4V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ5255B_R1_00301 产品概述
一、产品简介
MMSZ5255B_R1_00301 为 PANJIT（强茂）推出的独立式稳压二极管，标称稳压值 28V，公差为 ±5%（稳压范围 26.6V ～ 29.4V）。器件采用 SOD‑123 小型封装，适合空间受限的表面贴装应用，主要用于电压基准、浪涌抑制与低功耗稳压场合。
二、主要电气参数
- 标称稳压：28V（范围 26.6V～29.4V，±5%）
- 反向电流 Ir：100nA @ 21V（低反向泄漏，适合高阻抗电路）
- 最大耗散功率 Pd：500mW（在规定散热条件下）
- 动态阻抗 Zzt：44Ω（在测试电流下，表示良好的稳压特性）
- 膝部阻抗 Zzk：600Ω（低电流区的电压陡降特性）
- 工作结温：-55℃ ～ +150℃
三、典型应用场景
- 精密基准源与小电流稳压；
- 电源浪涌或过压瞬态钳位；
- 通信、仪表及便携式设备中的稳压与保护；
- 低功耗传感器与参考电路。
四、封装与焊接建议
SOD‑123 为小体积表面贴装封装，建议遵循厂商给出的回流焊曲线与焊盘设计。焊盘与散热铜箔面积直接影响 Pd 实际承受能力，需在 PCB 设计中预留足够散热路径并考虑多层接地铜层以提高热耗散能力。
五、使用与可靠性注意事项
- 功率限值：500mW 为最大耗散，实际使用中应根据工作环境温度进行降额，避免长期靠近 Pd 上限；
- 温度范围：器件工作结温可达 +150℃，存储与长期可靠性仍需避免持续高温。
- 泄漏电流：Ir 在 21V 时为 100nA，适合高阻抗场合，但在更高温度下会增加；
- 动态阻抗：Zzt 与 Zzk 指示在不同电流区的稳压性能，负载变化大时应评估稳压精度。
六、设计要点与总结
在设计中将 MMSZ5255B_R1_00301 用作分流稳压器时，应计算最大允许电流与对应功耗，合理选择限流电阻并在 PCB 布局上优化散热。其 28V 标称电压、低漏电与中等动态阻抗使其在中低功率、空间受限的保护与参考场合具有良好性价比。购买时请确认供应商原厂件并参考强茂数据手册以获得完整电气特性与焊接规范。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
