WMSIC Electronic Components

PANJIT MBR310AFC_R1_00601

ModelMBR310AFC_R1_00601
PackageSMAF-C
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MBR310AFC_R1_00601
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MBR310AFC_R1_00601
Electronic Component
1
Package
SMAF-C
Electronic Component
Schottky Diode
Electronic Component
0.07g
Electronic Component
1
Electronic Component
BM0264544585
Current
3A
Diode
1
Current(Ir)
50uA
(Vf)
800mV@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MBR310AFC_R1_00601 — PANJIT(强茂)100V/3A Schottky 整流二极管产品概述

一、产品简介

MBR310AFC_R1_00601 是强茂(PANJIT)推出的一款单只封装 Schottky 整流二极管,额定直流整流电流为 3A,反向耐压(Vr)100V。该器件采用 SMAF-C 表面贴装封装,设计用于开关电源、整流、续流、反接保护及多种电源管理场景,兼顾开关速度快与低正向压降的优点,适合要求高效率和紧凑板级设计的应用。

二、主要电气与热参数概述

  • 正向压降(Vf):0.8V(在 IF = 3A 条件下)
  • 直流反向耐压(Vr):100V
  • 额定整流电流:3A
  • 非重复峰值浪涌电流(Ifsm):80A
  • 反向漏电流(Ir):50μA(典型/测试条件下)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SMAF-C(SMD)

这些参数表明该器件在中等电流与较高电压场合具有良好性能,80A 的峰值浪涌能力对启动浪涌或瞬态锯齿纹有较强的承受力;0.8V 的正向压降在 3A 工作点下意味着较低的导通损耗,但仍需关注散热管理以保证结温在安全范围内。

三、典型应用场景

  • 开关电源二次侧整流(Synchronous 替代 / 非同步整流)
  • DC-DC 转换器输出整流、续流二极管
  • 反向电源保护与电源 OR-ing 电路
  • 车载电源(需根据系统温度与漏电容容忍度评估)
  • 充电器、适配器、LED 驱动等需要高效率整流的场合

在需要快速恢复与低正向压降来降低开关损耗的电源设计中,Schottky 二极管通常优于普通 PN 整流器。对于中高压(100V)场合,MBR310AFC 在效率与电压承受能力之间提供了平衡选择。

四、优点与设计注意事项

优点:

  • Schottky 结构带来快速开关与低反向恢复损耗,减少开关点的能量耗散。
  • 0.8V@3A 的正向压降在 100V 等级的 Schottky 中属于实用水平,有利于提高系统效率。
  • 峰值浪涌能力 80A,可应对瞬态冲击电流。
  • 工作温度范围宽,可满足工业级温度要求。

设计注意事项:

  • 漏电流随温度升高而显著增加。高温工作环境中应评估反向漏电对系统带来的影响(例如功耗或待机形态下的待机电流)。
  • 在 3A 工作电流下产生的导通损耗约为 Vf × I (0.8V × 3A ≈ 2.4W),需要在 PCB 布局与散热设计上预留足够的铜箔面积或热沉,以防结温过高。
  • SMAF-C 为 SMD 小封装,焊接时注意热阻与焊盘设计,避免散热不足。

五、PCB 布局与封装相关建议

  • 为减少寄生感抗和热阻,二极管与电感/电源线尽量紧凑布局,输入/输出走短、粗的铜线。
  • 增大焊盘铜面积并采用多层过孔接地或散热 via,有利于把热量传导到内层或散热面。
  • 焊接采用符合无铅回流温度曲线的工艺,并遵循厂商的封装焊接指南(若有),以保证焊点可靠性。
  • 对于车规或高可靠性应用,建议在实际环境温度下进行热仿真与寿命评估。

六、器件选型与使用建议

在选型时,若系统对正向压降有更严格要求可考虑低压(例如 40V、60V)级别 Schottky,通常这类器件 Vf 更低;但若系统需承受高反向电压,MBR310AFC 在 100V 等级中提供了兼顾浪涌能力与效率的方案。使用前应结合具体电路的最大结温、平均/峰值电流以及允许的反向漏电来评估是否满足系统需求。

总结:MBR310AFC_R1_00601 是一款面向中等功率、高电压整流场景的 Schottky 二极管,适用于对效率和开关性能有要求的电源与保护电路。合理的散热和布局可以充分发挥其低压降与高浪涌承受能力的优势。

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