WMSIC Electronic Components

PANJIT GR26EG_AY_000A2

ModelGR26EG_AY_000A2
PackageDO-41
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT GR26EG_AY_000A2
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
GR26EG_AY_000A2
Electronic Component
1
Package
DO-41
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.34g
Electronic Component
1
Electronic Component
BM0264240998
Current
1A
Diode
1
Current(Ir)
1uA
(Vf)
1.7V@1A
Power Dissipation(Pd)
1.5W
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GR26EG_AY_000A2 产品概述

一、概述

GR26EG_AY_000A2 是 PANJIT(强茂)出品的一款快恢复/高效率整流二极管,封装为 DO-41。此器件面向中低功率、高电压整流与开关应用,兼顾低正向压降与较短的反向恢复时间,适用于需要高耐压和较快开关性能的电源和变换器系统。

二、主要电气参数

  • 正向压降 Vf:1.7V @ 1A
  • 直流反向耐压 Vr:1000V(1kV)
  • 连续整流电流 If:1A
  • 峰值非重复浪涌电流 Ifsm:30A
  • 反向电流 Ir:1µA(常温)
  • 反向恢复时间 Trr:75ns
  • 功率耗散 Pd:1.5W
  • 工作结温范围 Tj:-55℃ ~ +175℃

三、特点与优势

  • 高耐压(1kV)适合高压整流与高侧保护应用。
  • 较低正向压降在 1A 工作点能提高效率、降低发热。
  • 反向恢复时间 75ns,在开关频率较高的电源中可减少开关损耗与 EMI。
  • 低反向漏电流(1µA)在高温或高阻负载场景有利于降低静态损耗。
  • 小型 DO-41 封装便于传统 through-hole 波峰或手工焊接生产。

四、典型应用场景

  • 开关电源(SMPS)与整流桥二极管替代件。
  • 太阳能逆变器、高压充电与电源滤波整流。
  • 电机驱动与电感自由轮二极管(freewheeling)。
  • 功率因数校正(PFC)电路、LED 驱动与保护电路。

五、设计与使用注意事项

  • 封装 Pd 为 1.5W,在 If=1A 情况下需注意散热与铜箔热阻,必要时采用散热垫或增加通孔铜面积。
  • 峰值浪涌 Ifsm 为 30A,但为非重复脉冲,设计时应考虑电流整形与保护,避免长期冲击。
  • 在高频开关应用中,Trr 对开关损耗和 EMI 有影响,如需更高频率可评估专用快恢复或肖特基器件。
  • 焊接峰值温度与回流/波峰焊工艺需按厂家推荐曲线执行,避免长时间高温引起性能退化。

六、封装与标识

DO-41 轴向引线封装,便于机加工和手工装配。二极管管体通常有标识带极性标记(阴极带),使用时请确认极性以免反向接入造成损坏。

七、可靠性与储存

  • 推荐工作环境温度与结温控制在器件规格范围内以保证长期可靠性。
  • 储存时避免潮湿、高温与强光照射,长期储存前建议按厂家要求进行烘干与防潮包装处理。

如需电路参考图、封装尺寸图或完整的温升/退化曲线,可联系供应商或索取 PANJIT 官方数据手册以获得详细规范与验证数据。

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