WMSIC Electronic Components

PANJIT SB3100_AY_10001

ModelSB3100_AY_10001
PackageDO-201AD
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT SB3100_AY_10001
Type
PANJIT
Minimum package
1250 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
SB3100_AY_10001
Electronic Component
1
Package
DO-201AD
Electronic Component
Schottky Diode
Electronic Component
1.148g
Electronic Component
1
Electronic Component
BM0234590024
Current
3A
Diode
1
Current(Ir)
500uA@100V
(Vf)
850mV@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1250

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SB3100_AY_10001 产品概述

一、产品简介

SB3100_AY_10001 为强茂(PANJIT)出品的肖特基整流二极管,额定整流电流3A、直流反向耐压100V,典型正向压降为850mV(在3A条件下),工作结温范围宽(-55℃至+150℃)。该器件以低正向压降和快速恢复特性著称,适合要求较低功耗和高效率的中小功率整流与保护场合。

二、主要电气参数

  • 正向压降(Vf):850mV @ If = 3A
  • 最大反向电压(Vr):100V
  • 最大整流电流:3A(连续)
  • 反向漏电流(Ir):500µA @ Vr = 100V
  • 工作结温范围:-55℃ ~ +150℃

以上参数为典型/最大值,具体应用时应参考完整数据表以确认浪涌电流、脉冲能力及热阻等详细指标。

三、封装与热性能

本型号采用 DO-201AD 轴向封装,结构坚固,便于穿孔安装与波峰/手工焊接。DO-201AD 封装有利于散热并承受一定的脉冲能量,但在高功率连续工作时仍需做好热设计——合理布局印制板、必要时加装散热器或增强自然对流。注意反向漏电随温度上升而增加,设计时应留有裕量。

四、典型应用场景

  • 开关电源及整流桥中的低压侧整流
  • DC-DC 转换器输出整流、同步整流替代件
  • 逆变器和太阳能系统的保护与防反接电路
  • 电池充电器、汽车电子的反向保护与续流回路
  • 任何需兼顾低压降与快速响应的中小功率整流场合

五、使用建议与注意事项

  • 反向漏电随温度升高显著增加,工作温度高时应评估漏电对系统的影响并适当降额。
  • 若有较大浪涌或短时脉冲电流需求,请参照厂方数据表的峰值脉冲能力并在必要时选用更高规格器件或并联使用(并联需注意电流共享)。
  • 焊接时遵循推荐温度-时间曲线,避免过高温度造成器件损伤或性能退化。
  • 存储与使用环境应防潮、防静电,库存周期过长或极端环境下请做可靠性验证。

六、质量与选型建议

强茂作为知名半导体厂商,产品有较完善的质量管理与出货检验。选型时建议对比同类肖特基(如其他厂商3A/100V等级)在Vf、Ir、热阻及峰值脉冲性能上的差异,以满足效率、热裕量和成本之间的平衡。如需更低正向压降或更高电流能力,可向供应商索取相近系列或升级型号的资料。

七、订购信息

型号:SB3100_AY_10001
品牌:PANJIT(强茂)
封装:DO-201AD
在采购与设计前,请获取并确认最新版产品数据手册与封装图,确保参数满足具体工况。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.