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PANJIT S3M-AU_R1_000A1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT S3M-AU_R1_000A1
- Type
- PANJIT
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- S3M-AU_R1_000A1
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.38g
- Electronic Component
- 1
- Electronic Component
- BM0230257482
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 1uA@1kV
- (Vf)
- 1.2V@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 800
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S3M-AU_R1_000A1 产品概述
一、产品简介
S3M-AU_R1_000A1 为 PANJIT（强茂）品牌的独立式整流二极管，封装为 SMC（DO-214AB）。该器件针对中高压整流场景设计，具有额定整流电流 3A、反向耐压高达 1kV 的特点，适合在高电压直流回路中做整流或阻断器件使用。
二、主要性能特点
- 直流正向压降：Vf = 1.2V @ 3A，正向导通时压降适中，便于在中等电流应用中控制导通损耗。
- 反向耐压：Vr = 1000V，能够承担高电压整流与耐压隔离要求。
- 额定整流电流：3A，适合中等功率整流模块与高压电源输出整流。
- 反向泄漏：Ir = 1µA @ 1kV，低漏电流有利于高压侧的静态功耗和电压保持。
- 封装：SMC（DO-214AB），表面贴装，利于自动化生产与散热设计。
三、典型应用场景
- 高压开关电源（HV SMPS）的输出整流或钳位电路。
- 工业电源、高压电源与电容充电电路。
- 逆变器、整流桥、HVDC 小功率线路以及需要高反向耐压的保护回路。
- 需要低反向泄漏以维持高压静态电压的测量与控制系统。
四、热管理与功耗估算
在 3A 工作条件下典型正向损耗约为 P = Vf × I = 1.2V × 3A ≈ 3.6W，器件在连续导通时会产生明显热量。建议在 PCB 布局上为 SMC 封装提供充分的铜箔散热区与贯通孔（vias）以向下层扩散热量，必要时并联铜面或使用散热器来降低结温并提高可靠性。
五、封装与安装要点
SMC（DO-214AB）为常见的表贴大体积封装，具备较好的功率承载能力与焊接可靠性。推荐按 PANJIT 官方资料进行焊接工艺控制（回流曲线与预热要求），避免过度机械应力与重复热循环；器件在板上应预留适当焊盘尺寸以保证热流与焊点强度。
六、设计与使用建议
- 在高压应用中留有安全裕度，实际工作电压建议低于最大 Vr，并考虑尖峰电压与浪涌。
- 计算通态损耗并验证散热设计，必要时采用并联或升额使用降低结温。
- 低漏电特性适合作为静态隔离元件，但仍需注意在高温条件下漏电可能上升，设计时考虑温度对性能的影响。
- 如需更快的开关性能或更低的正向压降，可对比同系或其他型号以选择最优器件。
七、质量与采购
PANJIT（强茂）为知名半导体元件供应商，SMC 封装便于批量 SMT 生产与后续维修。订购时请确认完整型号（S3M-AU_R1_000A1）、封装及规格参数一致，并索取最新数据手册以获取焊接规范、最大额定值与典型曲线，确保在实际产品设计中满足全部电气与环境要求。
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