WMSIC Electronic Components

PANJIT 1SMA4734_R1_00001

Model1SMA4734_R1_00001
PackageSMA(DO-214AC)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT 1SMA4734_R1_00001
Type
PANJIT
Minimum package
1800

Technical parameters

Electronic Component
PANJIT
Electronic Component
1SMA4734_R1_00001
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Zener Diode
Electronic Component
0.088g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
5Ω
Electronic Component
BM0230043987
Diode
1
Current(Ir)
10uA@2V
Power Dissipation(Pd)
1W
Electronic Component
5.3V~5.9V
Electronic Component
50℃~+150℃
Electronic Component
1800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4734_R1_00001 产品概述

一、概述

1SMA4734_R1_00001 为 PANJIT(强茂)生产的独立式稳压二极管(Zener),标称稳压值 5.6V,适用于对低功耗、稳定参考或浪涌钳位有要求的电子电路。封装为 SMA(DO-214AC),便于表面贴装与自动化组装,适合空间受限的消费类及工业类设备。

二、主要规格

  • 稳压值(标称):5.6V;稳压范围:5.3V ~ 5.9V
  • 反向电流 Ir:10 μA @ 2V
  • 耗散功率 Pd:1W(额定环境下)
  • 阻抗 Zzt:5 Ω; 阻抗 Zzk:600 Ω
  • 工作结温范围:-50 ℃ ~ +150 ℃
  • 封装:SMA(DO-214AC)
  • 品牌:PANJIT(强茂)

三、性能与优势

  • 稳压精度适用于微小电流下的电压参考与保护应用,标称 5.6V 可用于常见逻辑电源辅助稳压。
  • 低反向漏电(10 μA@2V)减少对高阻抗节点的影响,适合电池供电或省电设计。
  • 1W 的耗散能力在紧凑封装中提供了较好的能量吸收能力,适用于中小功率的浪涌抑制。
  • 宽温度范围和工业级结温使其能适应严苛工作环境。

四、典型应用

  • 基准电压源、小信号稳压电路
  • 输入浪涌与过压保护、接口钳位(通信、传感器接口等)
  • 电池管理与电源监控电路的电压监测与保护
  • 工业控制、仪器仪表与消费电子的局部稳压

五、封装与可靠性

SMA(DO-214AC)封装兼顾体积与散热,适合回流焊工艺。器件应在推荐回流温度曲线内焊接以确保可靠性。工作时需关注PCB散热设计与周围器件热耦合,保证在实际应用中不超过额定耗散功率。

六、使用建议

  • 在设计中应按实际工作电流与PCB散热条件对 Pd 进行降额设计,避免长期工作在极限耗散下。
  • 对于精密参考场合,应在电路中加入限流电阻与旁路电容以减小动态噪声与稳压器件的应力。
  • 选型与采购请确认完整型号(1SMA4734_R1_00001)与批次,必要时参考 PANJIT 官方数据手册以获取详细特性曲线与焊接规范。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.