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PANJIT BAV99TB_R1_00001
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT BAV99TB_R1_00001
- Type
- PANJIT
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- BAV99TB_R1_00001
- Electronic Component
- 1
- Package
- SOT-523
- Electronic Component
- Switch Diode
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM0265005832
- Current
- 75mA
- Diode
- 1
- Current(Ir)
- 2.5uA@75V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV99TB_R1_00001 产品概述
一、产品简介
BAV99TB_R1_00001 为 PANJIT（强茂）生产的小信号开关二极管，采用 SOT-523 超小封装，内部为一对串联式二极管。器件定位于高速开关、信号整流与保护应用，凭借极短的反向恢复时间与低反向电流，适合高频脉冲和精密信号路径使用。
二、主要电气参数
- 二极管配置：1 对串联式
- 直流正向电流（Io）：75 mA（典型整流电流）
- 正向压降（Vf）：1.25 V @ 0.15 A
- 直流反向耐压（Vr）：75 V
- 反向电流（Ir）：2.5 μA @ 75 V
- 非重复峰值浪涌电流（Ifsm）：4 A（一次性脉冲）
- 反向恢复时间（Trr）：4 ns（高速开关特性）
- 耗散功率（Pd）：200 mW
- 工作结温范围：-55 ℃ ~ +150 ℃
三、产品特点
- 小尺寸封装（SOT-523），适合高密度贴片设计，节省 PCB 面积。
- 低反向电流与高耐压组合，兼具信号完整性与抗干扰能力。
- 极短的反向恢复时间（4 ns），适合快速开关与高频应用，减少开关损耗与延迟。
- 较高的单次浪涌承受能力（4 A），在瞬态冲击下仍有良好鲁棒性。
四、典型应用场景
- 高速数字开关与门电路中的信号整形与保护。
- 高频脉冲电路与时钟分配网络中的快速整流/钳位。
- 接口防护与小信号整流，例如射频前端、混频器保护。
- 移动设备、消费电子和通信设备中用于节省空间的开关二极管需求。
五、封装与安装建议
- 封装：SOT-523，适合自动贴装与回流焊工艺。
- 热管理：器件耗散功率较低（200 mW），在设计时应避免长期大电流工作并注意 PCB 散热路径，采用短且粗的铜箔连接以降低热阻。
- 焊接：遵循标准回流曲线，避免超温或长时间高温暴露以保护小型封装。
- 布局：信号走线尽量短且靠近地线回流，敏感信号邻近避开高功率热源。
六、选型与注意事项
- 本器件适合小信号与开关用途，不建议用于大功率整流或持续高电流场合。
- 选型时关注正向电流与功耗边界，必要时采用并联或选择更大封装器件以满足热稳定性要求。
- 如需自动化贴装的卷带规格或特殊包装（如 R1_00001 表示的包装代码），请向经销商或制造商确认对应的包装与最小起订量。
如需完整数据手册（电学曲线、典型应用电路、封装尺寸与回流焊曲线）或样品测试建议，我可以为您提供进一步资料。
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