WMSIC Electronic Components

PANJIT MBR210AFC_R1_00601

ModelMBR210AFC_R1_00601
PackageSMAF-C
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MBR210AFC_R1_00601
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MBR210AFC_R1_00601
Electronic Component
1
Package
SMAF-C
Electronic Component
Schottky Diode
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0264544589
Current
2A
Diode
1
Current(Ir)
50uA
(Vf)
800mV@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MBR210AFC_R1_00601 产品概述

一、产品简介

MBR210AFC_R1_00601 是强茂(PANJIT)推出的一款单个独立式肖特基整流二极管,封装为适合表贴的 SMAF-C。该器件在导通时具有低正向压降(Vf = 0.8V @ 2A),并能承受最高直流反向电压 100V,连续整流电流为 2A,适用于各种中小功率开关电源和整流场合。

二、主要电气参数(关键指标)

  • 器件类型:单个独立肖特基二极管
  • 正向压降:Vf = 0.8V(测试条件 2A)
  • 直流反向耐压:Vr = 100V
  • 连续整流电流:2A
  • 反向漏电流:Ir = 50µA(典型测量条件)
  • 非重复峰值浪涌电流(Ifsm):50A(单次冲击)
  • 工作结温范围:-55℃ ~ +150℃

三、产品特性与优势

  • 低正向压降:在较高电流下保持较低损耗,有利于提高整流效率并降低发热。
  • 快速响应与低反向恢复:作为肖特基器件,适合高频开关电源和整流器中的快速整流需求。
  • 良好冲击承受力:50A 的非重复峰值浪涌能力,可应对通电瞬态和浪涌负载。
  • 宽温度范围:-55℃~+150℃ 的结温范围,适合工业级环境应用。
  • 表面贴装封装(SMAF-C):适合自动化贴装与高密度 PCB 设计。

四、典型应用场景

  • 开关电源输出整流与同步整流替代
  • DC-DC 转换器、SMPS 输出二极管
  • 反向保护/极性保护电路
  • 电池充放电路径与充电器整流
  • 电机驱动回流二极管、车载电子(低压子系统)及工业控制设备

五、热管理与布板建议

  • 虽然正向压降较低,但在 2A 持续工作时仍会产生显著功耗,建议在 PCB 上提供适当的散热铜箔(扩大焊盘面积)并视情况加装热铜通孔。
  • 将二极管置于靠近发热源或输出端的位置,缩短电流路径以降低寄生阻抗。
  • 在高温工况下(如环境温度或 PCB 温升较大),要考虑对额定电流进行降额,以保证长期可靠性。

六、可靠性与注意事项

  • 反向漏电随结温上升显著增加,设计时应评估最坏工况的漏电和功率损耗。
  • Ifsm 指标为单次非重复浪涌能力,设计中不要依赖多次浪涌承载,若系统存在频繁浪涌需采取保护或选择更高规格器件。
  • 焊接与回流工艺应参考 PANJIT 的封装工艺说明,避免超温或过长回流时间造成器件应力。
  • 长期运行建议在高温条件下进行老化与可靠性验证。

七、封装与采购信息

  • 品牌:PANJIT(强茂)
  • 型号:MBR210AFC_R1_00601
  • 封装:SMAF-C(表面贴装,适合自动化贴片)
    购买和样品咨询建议通过强茂授权分销商或官方渠道获取,以确保追溯性与真伪保障。

如果需要,我可以为您提供更详细的电气特性曲线解读、典型应用电路参考或 PCB 散热尺寸建议。

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