Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US1J_R1_00101是台湾强茂电子(PANJIT)推出的独立式超快恢复二极管,属于中小功率整流器件。型号中“US”代表超快恢复特性,“1”对应额定整流电流,“J”关联600V耐压规格,封装采用SMA表面贴装形式,适配现代电子设备的小型化、高密度设计需求。
该器件的关键参数直接决定其应用场景与性能表现,具体解读如下:
连续正向整流电流为1A(25℃环境下额定值),实际应用需结合结温降额(如150℃时降额至约0.6A),可满足多数中小功率电路的整流需求。
反向截止状态下可承受最大600V电压,无击穿风险,覆盖220V市电整流、300V直流逆变等常见场景。
反向电压下漏电流仅1μA(典型值),属于低损耗设计:既减少待机能量消耗,又降低反向发热,提升长期可靠性。
反向恢复时间(Trr)为100ns,是“超快恢复”核心体现——比普通快恢复二极管(200ns以上)短,可显著降低高频电路的开关损耗,减少电磁干扰(EMI)。
宽温度范围适配工业级极端环境:低温端适应户外低温、航空辅助电路;高温端耐受电源内部高发热区域,无需额外散热优化。
US1J_R1_00101采用SMA表面贴装封装,具备以下优势:
此外,器件优化了芯片与封装的热传导路径,确保结温稳定在额定范围内,延长产品寿命。
结合参数特性,该器件适用于以下高频、中小功率电路:
相比普通/常规快恢复二极管,US1J_R1_00101的核心优势:
该器件凭借超快恢复、宽温可靠、小体积等特性,成为中小功率高频电路的优选整流器件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products