WMSIC Electronic Components

PANJIT RS1JWG_R1_00001

ModelRS1JWG_R1_00001
PackageSMA-W
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT RS1JWG_R1_00001
Type
PANJIT
Minimum package
1800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
RS1JWG_R1_00001
Electronic Component
1
Package
SMA-W
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.113g
Electronic Component
1
Electronic Component
BM0227309754
Current
1A
Diode
1
Current(Ir)
5uA@600V
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS1JWG_R1_00001 产品概述

一、概述

RS1JWG_R1_00001 是 PANJIT(强茂)推出的独立式快恢复/高效率整流二极管,封装为 SMA-W,额定整流电流 1A,直流反向耐压 600V。器件专为高压整流与中等频率开关电源场合设计,兼顾开关损耗与导通损耗,适用于要求可靠性与性价比的功率电子电路。

二、关键参数

  • 二极管配置:独立式
  • 工作结温:-55℃ ~ +150℃ (Tj)
  • 正向压降 Vf:1.3V @ 1A
  • 非重复峰值冲击电流 Ifsm:30A(单次浪涌能力)
  • 直流反向耐压 Vr:600V
  • 反向电流 Ir:5 μA @ 600V
  • 反向恢复时间 Trr:250 ns
  • 额定整流电流:1A
  • 封装:SMA-W
    这些参数表明器件在 600V 级别具有较低漏电和中等恢复性能,能在开关频率较低至中等范围内工作。

三、主要特性与优势

  • 高耐压:600V 额定适合离线电源、逆变器前级等高压场合。
  • 低漏电:5 μA(@600V)利于减少待机功耗与热损失。
  • 中等快速恢复:Trr≈250ns,在中频开关(数十 kHz 至百 kHz 级)中表现平衡。
  • 良好冲击能力:Ifsm=30A 能承受启动及短时故障浪涌电流。
  • 商用封装:SMA-W 易于自动贴装与焊接,适合批量生产。

四、典型应用场景

  • 开关电源(SMPS)次级整流或高压整流回路
  • 电源适配器、电视、显示器等离线电源
  • 电机驱动回生回路与反向吸收二极管
  • 不间断电源(UPS)与逆变器的高压整流
  • 电池充电与保护电路的整流/保护元件

五、设计与布局建议

  • 导通损耗估算:在 1A 工作点,Pd ≈ 1.3W,需在 PCB 上提供良好散热路径(加宽铜箔或散热垫)。
  • 高频开关时注意 Trr 带来的反向恢复电流,必要时在二极管前后加 RC 或缓冲网络以抑制尖峰。
  • 浪涌场合请保证 Ifsm 不被多次重复触发;在设计中考虑浪涌保护与保险元件配合。
  • 焊接与回流:遵循封装热循环规范,避免过度热应力;SMA-W 适合标准回流工艺。

六、可靠性与选型参考

RS1JWG_R1_00001 在高压整流与中等频率开关应用中提供可靠性能。若追求更低正向压降以提高效率,可考虑低压差肖特基二极管,但肖特基器件在 600V 级别受限;如需更短反向恢复时间,应选用超快恢复二极管或专用快恢复系列。选型时应综合电压、频率、效率与热管理需求。

如需器件数据手册、封装尺寸或建议的 PCB 版图,请告知,我可提供更详细的图纸与设计参考。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.