WMSIC Electronic Components

PANJIT BAT42WS_R1_00001

ModelBAT42WS_R1_00001
PackageSOD-323
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT BAT42WS_R1_00001
Type
PANJIT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
BAT42WS_R1_00001
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0230043178
Current
200mA
Diode
1
Current(Ir)
500nA@30V
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT42WS_R1_00001 产品概述

BAT42WS_R1_00001 是 PANJIT(强茂)推出的一款肖特基屏障二极管,采用小型 SOD-323 封装,面向低功耗、快速恢复与瞬态抑制类应用。器件在 0.2A 条件下正向压降约 1.0V,反向耐压 30V,直流整流电流 200mA,反向漏电流仅 500nA(@30V),并能承受 4A 的非重复峰值浪涌电流,结温范围宽(-55℃ 至 +125℃),适合对尺寸、速度和低泄漏有严格要求的场合。

一、主要特性

  • 型号:BAT42WS_R1_00001
  • 品牌:PANJIT(强茂)
  • 封装:SOD-323(超小型表面贴装)
  • 正向压降(Vf):≈1.0V @ 0.2A
  • 直流反向耐压(Vr):30V
  • 直流整流电流:200mA(连续)
  • 反向电流(Ir):500nA @ 30V
  • 非重复峰值浪涌电流(Ifsm):4A
  • 工作结温范围:-55℃ ~ +125℃

二、器件特点与优势

  1. 低正向压降:在 0.2A 条件下 Vf≈1V,降低功耗与热耗,有助于提升系统效率。
  2. 低反向漏电流:500nA(@30V)使其在高阻态需求与微弱信号路径中表现良好,适合低功耗与待机电路。
  3. 良好浪涌承受能力:4A 的非重复峰值浪涌电流能应对瞬态冲击和开启浪涌,增强系统鲁棒性。
  4. 小型化封装:SOD-323 提供占板面积小的解决方案,便于移动设备与高密度 PCB 布局。
  5. 宽工作温度:-55℃ ~ +125℃ 满足工业级与车用周边低/高温工作环境需求(请依据具体应用参见厂商温度/功率降额曲线)。

三、典型应用场景

  • 低功耗电源的整流与续流路径(如便携式设备、手持终端)。
  • 反向保护与极性保护电路(防止电源接反损坏)。
  • 信号钳位、过压/浪涌抑制与钳位保护(低电流方案)。
  • 快速开关电路与高频整流(得益于肖特基器件的低储能与快速响应)。
  • 充电管理与电池保护子电路(对漏电与压降敏感的场合)。

四、封装与热管理建议

SOD-323 为超小型表贴封装,适用于贴装密度高的设计。由于体积小,器件的散热能力有限,设计时应注意:

  • 在 PCB 上为二极管增加适当铜箔面积以改善散热。
  • 考虑在高环境温或连续高电流工况下进行功率降额与热仿真。
  • 遵循 PANJIT 的回流焊温度曲线与湿敏等级要求,避免超温或潮湿引起的可靠性问题。

五、选型与使用注意

  • 若应用电流高于 200mA 或需更高反向耐压,应选择额定更高的型号;若追求更低 Vf,可比较同系列或其它厂商的低 Vf 版本。
  • 评估系统中的最大反向电压与温度,以确保反向漏流和结温在可接受范围内。
  • 对于频繁的浪涌事件,建议结合限流或缓冲电路以延长元件寿命。
  • 采购时确认包装形式(单管、散装、带卷盘)与批次,如需资料请向供应商索取最新 Datasheet 以获取完整电气特性曲线与封装尺寸。

如需进一步的电气特性曲线、封装尺寸图或 PCB 推荐布局,请提供具体应用场景或联系 PANJIT 官方技术支持获取完整规格书。

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