WMSIC Electronic Components

PANJIT US1D_R1_00101

ModelUS1D_R1_00101
PackageSMA
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT US1D_R1_00101
Type
PANJIT
Minimum package
1800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
US1D_R1_00101
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.076g
Electronic Component
1
Electronic Component
BM0257700006
Current
1A
Diode
1
Current(Ir)
1uA
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

US1D_R1_00101 快恢复/高效率二极管 产品概述

一、产品简介

US1D_R1_00101 是 PANJIT(强茂)推出的一款独立式快恢复高效率整流二极管,采用 SMA 封装。该器件专为开关电源和高频整流场合设计,兼顾低正向压降与较快的恢复特性,能够在中等频率电源转换与浪涌抑制场景中提供可靠的整流与保护功能。

二、主要电气参数

  • 正向压降 (Vf):1.3 V @ IF = 1 A
  • 直流反向耐压 (Vr):200 V
  • 额定整流电流:1 A(直流)
  • 反向漏电流 (Ir):1 μA(通常在额定 Vr 下)
  • 反向恢复时间 (Trr):50 ns(快恢复特性,有助于降低开关损耗)
  • 结温工作范围:-55 ℃ ~ +150 ℃

以上参数适用于典型测试条件,实际应用中请参考厂商完整数据手册并考虑 PCB 散热与环境温度对性能的影响。

三、封装与热性能

SMA 封装体积小、适合集成密集电路板,但受限于热阻和散热面积。尽管器件额定为 1 A 连续整流,实际持续电流能力受 PCB 铜箔面积和工作温度影响。建议在高负载或高环境温度应用中通过加大铜箔厚度/面积或增加散热结构来改善热管理。

四、典型应用场景

  • 中小功率开关电源(SMPS)输出整流
  • 适配器、充电器的高频整流段
  • 逆变/变换器的续流/自由轮二极管
  • 保护电路,如极性反接保护与浪涌吸收
  • 工业控制与消费电子中对效率与开关损耗有要求的整流场合

五、使用建议与注意事项

  • 在高频开关场合,50 ns 的反向恢复时间可显著降低二极管在切换瞬间的能量损耗,但在极高频率或对恢复尖峰敏感的电路中,仍需配合 RC 抑制或缓冲网络以控制电压振铃。
  • 反向漏电流会随温度上升而增加;在高温环境下应留有裕量。
  • 焊接与回流时请遵循 PANJIT 或通用的封装焊接规范,避免过热造成器件损伤。
  • 在需要承受更大浪涌电流或更高平均功率时,请考虑使用更大功率封装或并联设计,并核对峰值冲击能力。

六、采购与替代

PANJIT 品牌提供的 US1D_R1_00101 适合追求成本与性能平衡的中低功率整流应用。如需替代件,请匹配关键参数:Vr ≥ 200 V、IF ≥ 1 A、Vf 接近 1.3 V、Trr 接近或优于 50 ns,并保持 SMA 或兼容封装以便于 PCB 布局替换。详情与样品或批量采购建议联系官方渠道或授权分销商,并参考最新数据手册以获取完整电气与机械规格。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.