WMSIC Electronic Components

PANJIT DI1010S_R2_00001

ModelDI1010S_R2_00001
PackageSDIP(T/R)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT DI1010S_R2_00001
Type
PANJIT
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
DI1010S_R2_00001
Electronic Component
1
Package
SDIP(T/R)
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.549g
Electronic Component
1
Electronic Component
BM0264484541
Current
1A
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DI1010S_R2_00001 产品概述

一、产品简介

DI1010S_R2_00001 是 PANJIT(强茂)出品的一款高压单相整流桥,采用紧凑的 SDIP-4 封装(SDIP(T/R)),适用于需要高耐压、低漏电的小电流整流场合。器件在 1A 工作电流下正向压降仅为 1.1V,反向耐压高达 1kV,具备良好的短时浪涌承受能力和宽温度范围的工作稳定性。

二、主要参数

  • 正向压降(Vf):1.1V @ 1A(单只导通)
  • 直流反向耐压(Vr):1000V(1kV)
  • 额定整流电流:1A(连续)
  • 反向漏电流(Ir):5 μA @ 1kV
  • 非重复峰值浪涌电流(Ifsm):30A(短时脉冲)
  • 工作结温范围:-55℃ ~ +150℃
  • 类型:单相整流桥
  • 封装:SDIP-4(带 T/R 包装,便于自动化贴装/组装)
  • 品牌:PANJIT(强茂)
  • 型号:DI1010S_R2_00001

三、主要特性与优势

  • 高耐压设计:1000V 反向耐压适合高压供电与倍压电路,可在高电压环境下提供可靠整流。
  • 低反向漏电流:在 1kV 反压下仅 5 μA 的漏电流,适合对漏电要求严格的测量与高压偏置场合。
  • 较低正向压降:1A 时单只导通压降 1.1V;桥式整流时正向总压降约为两个二极管之和(约 2.2V),有利于降低整流损耗。
  • 良好浪涌能力:30A 的短时峰值浪涌电流能承受瞬态冲击,提升系统抗短时过载能力。
  • 宽温区可靠性:-55℃ 至 +150℃ 的工作结温范围满足工业级与军工级温度要求。

四、典型应用场景

  • 高压直流电源与倍压整流器(如偏压电源、探测器偏压)
  • 仪器仪表高压电源、小型高压供电模块
  • 高压检测与保护电路、老式显示与电子管偏压电路
  • 需低漏电与高耐压的测量放大器供电和偏置场合

五、安装与散热建议

  • SDIP-4 封装为小体积双列直插形式,便于穿孔安装。安装时建议合理布置接地与散热铜箔,减小结温上升。
  • 连续工作接近额定 1A 时应注意结温管理,必要时通过加大 PCB 铜箔、散热片或改善通风来降低结温以延长可靠性。
  • 注意焊接温度和时间,遵循厂商推荐的回流/波峰焊工艺参数以免损伤封装或引脚。

六、可靠性与测试提示

  • 反向漏流随温度和反向电压快速上升,设计时应留有裕量,避免长期在接近 Vr 条件下工作。
  • 若电路会出现较长时间或频繁高压瞬变,建议在系统层面加装限流或保护元件(如限流电阻、浪涌抑制器)以保护整流桥。
  • 出厂前通常经过电气性能和温度循环测试,适合要求稳定性的工业应用。

七、包装与订购信息

  • 封装:SDIP-4,供货形式支持 T/R(带卷)便于自动化装配。
  • 品牌与型号:PANJIT(强茂) DI1010S_R2_00001。
  • 订购时请注明型号和封装形式,若用于特殊温度或可靠性等级的项目,请与供应商确认相关测试与合格证书。

如需电路参照、封装图或更详细的热特性与处理建议,可提供进一步资料或原厂规格书以便准确设计与验证。

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