Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT BZT52-B3V6S BZT52
Configuration
1 options
Configuration
18+
Available for RFQ
Technical data
Product details
12
specifications
Core information
- Product name
- PANJIT BZT52-B3V6S
- Type
- PANJIT
- Minimum package
- 5000
Technical parameters
- Electronic Component
- PANJIT
- Electronic Component
- BZT52-B3V6S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0000280581
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52-B3V6S是一款由PANJIT（强茂）生产的Zener二极管，旨在提供稳压功能，广泛应用于各种电子电路中。该产品采用SOD-323封装，适合空间有限的小型电子设备，能够在保持高性能的同时节省PCB空间。
1. 功能与特点
稳压特性：BZT52-B3V6S的主要功能是为电路提供稳压保护，为各种电子元器件提供稳定的工作电压。其Zener击穿电压为3.6V，适合用于需要3.6V稳压的场合。
高品质：作为强茂品牌的产品，BZT52系列二极管具有高可靠性和稳定性，符合国际标准，确保在严苛环境下仍能正常工作。
低功耗：由于该二极管的设计针对高效能电流控制，能够有效降低能耗，特别适合用于低功耗应用。
2. 应用领域
BZT52-B3V6S的应用领域非常广泛，涵盖了多个行业：
消费电子：如手机、平板电脑等便携设备，通常需要高效的稳压解决方案，以保护电路免受电压波动的影响。
通信设备：在无线通信、数据传输等设备中，提供稳定的工作电压，确保信号传输的稳定性。
汽车电子：在现代汽车中，电子元器件众多，BZT52-B3V6S可用于保护车载电子设备，防止电压尖峰对电路造成损害。
工业控制：在自动化设备和控制系统中，稳压器的需求较高，可以有效保护敏感的控制电路。
3. 电气特性
BZT52-B3V6S具有以下主要电气特性：
- Zener电压（Vz）：3.6V
- 最大反向工作电压（Vr）：5V
- 动态阻抗（Zz）：在Iz=10mA时，动态阻抗约为5Ω
- 额定功率（Pd）：500mW
- 工作温度范围：-55°C至+150°C，适应各种恶劣环境
这些参数使得BZT52-B3V6S能够在高电压及高温条件下仍能保持优异的性能，满足不同应用需求。
4. 结论
总之，BZT52-B3V6S是一款极具竞争力的稳压Zener二极管，适合用于各类需要稳定输出电压的电子设计。其高效、可靠及小巧的特性使其在现代电子设计中备受青睐。无论是消费电子、汽车电子还是工业控制系统，BZT52-B3V6S都能提供卓越的性能，让设计工程师在不同的应用中能够安心选择，减少电路故障带来的影响。
随着电子设备对稳压和电源管理功能的需求不断增加，BZT52-B3V6S有望在未来的市场中继续占据重要位置，迎接更加广泛的应用场景。在选择合适的稳压解决方案时，BZT52-B3V6S无疑是一个值得考虑的优质产品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
