Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT ES2D_R1_00001
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT ES2D_R1_00001
- Type
- PANJIT
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- ES2D_R1_00001
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.111g
- Electronic Component
- 1
- Electronic Component
- BM0257662890
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 1uA@200V
- (Vf)
- 950mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1800
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES2D_R1_00001 产品概述
一、产品简介
ES2D_R1_00001 是强茂（PANJIT）推出的一款独立式快恢复整流二极管，采用SMA（DO-214AC）封装。器件属于 Super Fast Recovery 类型，专为开关电源、高速整流和脉冲环境中的高效整流与保护而设计，兼顾低正向压降与较短的反向恢复时间，适用于中功率、高电压场合。
二、主要参数
- 正向压降 (Vf)：0.95 V @ 2 A
- 直流反向耐压 (Vr)：200 V
- 平均整流电流：2 A
- 反向电流 (Ir)：1 μA @ 200 V
- 反向恢复时间 (Trr)：35 ns
- 非重复峰值浪涌电流 (Ifsm)：50 A
- 工作结温范围：-55 ℃ ~ +150 ℃
- 封装：SMA (DO-214AC)；品牌：PANJIT（强茂）
三、性能特性
- 低正向压降在额定整流电流下可降低导通损耗，典型功耗约为 Vf×I = 0.95 V × 2 A ≈ 1.9 W（用于估算散热需求）。
- 35 ns 的反向恢复时间在常见开关频率下能显著减小开关损耗和电磁干扰，适合开关电源与电机驱动等场景。
- 200 V 的反向耐压与微安级反向漏电流保证了在高压工况下的可靠性与低静态损耗。
- 封装小巧，适合表面贴装与自动化生产。
四、典型应用场景
- 开关电源（SMPS）输出整流与输入桥式整流
- 适配器、充电器、照明驱动电源
- 电机驱动中的再生回路与自由轮整流
- 工业脉冲电路与逆变器保护电路
五、封装与散热建议
SMA（DO-214AC）封装便于贴片生产。由于在高电流工作时器件功耗显著，电路板应采用充足的铜箔散热（延长焊盘、增加过孔或散热铜平面），同时在封装附近留出散热空间，必要时采用外部散热片或并联器件分担热量。推荐按实际应用测量结温并留有适当的安全裕度。
六、使用注意事项
- 在设计时考虑反向恢复导致的电压尖峰与开关损耗，必要时配合缓冲网络或RC吸收。
- 浪涌电流能力（Ifsm）为短时非重复峰值能力，设计应避免长期超载或频繁大幅浪涌。
- 存储与焊接遵循常规无铅回流工艺要求，防止过热超时影响可靠性。
- 对ESD和机械应力采取常规防护措施，确保长期稳定工作。
ES2D_R1_00001 在中高压、快恢复需求的整流与保护应用中，凭借低压降、短恢复时间与可靠的高温工作能力，提供了性价比良好的解决方案。若需更详细的电气特性曲线或封装外形尺寸图，可参考厂商完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
