WMSIC Electronic Components

PANJIT 1SMA5931_R1_00001

Model1SMA5931_R1_00001
PackageSMA(DO-214AC)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT 1SMA5931_R1_00001
Type
PANJIT
Minimum package
1800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
1SMA5931_R1_00001
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Zener Diode
Electronic Component
0.111g
Electronic Component
1
(Zzk)
650Ω
(Zzt)
12Ω
Electronic Component
BM0263665328
Diode
1
Power Dissipation(Pd)
1.5W
Electronic Component
17.1V~18.9V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA5931_R1_00001 产品概述

一、产品简介

1SMA5931_R1_00001 为 PANJIT(强茂)生产的一款独立式稳压二极管(Zener),采用SMA(DO-214AC)表面贴装封装,标称稳压值 18V,额定耗散功率 1.5W(1500mW)。该器件为低功率、高可靠性的稳压与过压保护元件,适合在有限空间内实现稳压基准与浪涌吸收功能。

二、主要参数

  • 稳压值(标称):18V
  • 稳压值范围:17.1V ~ 18.9V
  • 额定耗散功率 Pd:1.5W
  • 反向电流 Ir:1µA @ 13.7V
  • 动态阻抗 Zzt:12Ω
  • 低电流拐点阻抗 Zzk:650Ω
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SMA (DO-214AC),单只独立式

三、性能特点

  • 精确的中等电压稳压:18V 标称电压适用于多种中高电压稳压需求。
  • 低漏电流:Ir 仅为 1µA(在13.7V 下测),在高阻抗电路中有利于降低静态功耗。
  • 良好的动态特性:Zzt=12Ω 在规定测试电流下表现出较低的动态阻抗,稳压电平随电流变化较小。
  • 抗突发能力:SMA 封装兼顾体积与散热,适合受限空间内的功率吸收与瞬态抑制。
  • 宽温范围:-55℃~+150℃,适用于工业级温度环境。

四、典型应用场景

  • 稳压参考源与基准电压输出
  • 输入过压保护与浪涌吸收(电源输入端、接口保护)
  • 电池管理与充电电路的保护元素
  • 工业控制、通信设备及消费电子中需要中等功率稳压的场合

五、封装与热管理建议

SMA(DO-214AC)为标准表面贴装封装,适配自动化贴装与回流焊工艺。由于器件Pd为1.5W,在实际电路设计中应注意热阻与PCB散热布局:

  • 在九宫格或大铜箔区域增加散热铜层,并与金属地平面相连以降低结温。
  • 在高耗散工况下采用降额使用,避免长时间接近最大Pd。
  • 推荐按照厂商回流焊温度曲线进行焊接,以免影响器件可靠性。

六、选型与使用注意事项

  • 确认工作电流和功耗:稳压二极管的功耗随反向电流增加,设计时需计算在最大工作电流下产生的功耗并与Pd进行比较。
  • 注意稳压电压范围:器件在不同电流时稳压值会有微小变化,请参考电流-电压特性确保满足精度要求。
  • 对浪涌电流进行评估:若用于浪涌或脉冲抑制,应评估瞬态能量并考虑并联或更高功率器件。
  • 环境与可靠性:在高温或散热受限的场合应增加散热措施或选择更高功率等级的器件。

七、可靠性与包装

PANJIT 品牌提供符合工业级可靠性要求的器件生产与测试流程。SMA 包装适合卷带自动化贴装,出厂前经过参数筛选与外观检验。订购或替换时请确认完整型号与批次以保证一致性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.