Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT SK24-AU_R1_000A1 SK24
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SK24-AU_R1_000A1
- Type
- PANJIT
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SK24-AU_R1_000A1
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.108g
- Electronic Component
- 1
- Electronic Component
- BM0227335367
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 90uA@40V
- (Vf)
- 500mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 800
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SK24-AU_R1_000A1 产品概述
一、产品简介
SK24-AU_R1_000A1 是强茂（PANJIT）出品的一款肖特基势垒二极管整流器，封装为 SMB (DO-214AA)。该器件面向中等功率整流与开关电源应用，兼具低正向压降与快速响应的特点，适用于要求高效率和宽温度范围的工业和消费电子场合。
二、关键电气参数
- 工作结温范围：-55℃ ~ +150℃
- 额定整流电流（IO）：2A（直流）
- 正向压降（Vf）：典型 0.5V @ 2A
- 直流反向耐压（Vr）：40V
- 反向漏电流（Ir）：90μA @ 40V
- 非重复峰值浪涌电流（Ifsm）：50A（单次脉冲）
以上参数表明该器件在中等电流下具有较低的导通损耗，同时能承受较高的瞬态浪涌，适合用于整流与保护类电路。
三、主要特性与优势
- 低正向压降：降低导通损耗，改善整流效率，适合低压差电源与高频开关电路。
- 快速恢复 / 近似无恢复时间：肖特基二极管本质上恢复时间极短，减小开关损耗与电磁干扰。
- 宽温度工作范围：-55℃~+150℃，适应严苛工况与高温环境。
- 良好的浪涌承受能力：50A 非重复峰值浪涌电流，能应对启动或短时冲击电流。
四、典型应用场景
- 开关电源（AC/DC、DC/DC）输入与输出整流
- 电池充放电路径与电源反向保护
- 电源管理模块、LED 驱动器
- 工业控制与通讯设备的整流与保护
- 需要高效率和快速切换的功率电子电路
五、封装与热管理建议
SMB（DO-214AA）封装在体积与散热之间取得平衡，但仍需注意布局与散热：
- PCB 布局建议增大焊盘铜面积并使用散热铺铜或通孔导热，提高热阻能力。
- 在高电流或高温工作条件下，建议参考器件资料中的结-环境温度导出曲线进行电流降额。
- 遵循厂家推荐的回流焊温度曲线与焊盘尺寸以保证焊接可靠性。
六、可靠性与选型注意事项
- 反向漏电流随温度上升显著增加，设计时应考虑高温工况下的漏电影响；如用于高绝缘或低泄漏要求场合，请确认实际 Ir 在工作温度下是否满足系统需求。
- 若用于汽车或功能安全相关系统，应核对供应商的可靠性认证与测试数据（如有 AEC-Q 认证需明确）。
- 大电流并联或冗余设计时应注意电流分享问题，推荐使用匹配的器件与合适的热布局。
如需进一步的封装尺寸图、热阻参数、典型电气特性曲线或贴片焊盘建议，请提供需要的项目或直接参考 PANJIT 官方数据手册以获取完整规范与测试条件。
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