Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT SS1040L_R1_00001
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SS1040L_R1_00001
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SS1040L_R1_00001
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0227309752
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 220uA@40V
- (Vf)
- 450mV@1A
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS1040L_R1_00001 产品概述
一、产品简介
SS1040L_R1_00001 是强茂（PANJIT）出品的一款肖特基势垒二极管/整流器，封装为 SOD-123，面向便携设备、小型开关电源及一般整流保护场景。该器件以低正向压降与较高浪涌承受能力为核心特点，适合对效率与体积有要求的系统设计。
二、主要电气参数
- 正向压降 Vf：450 mV @ 1 A（典型值）
- 直流反向耐压 Vr：40 V
- 反向电流 Ir：220 μA @ 40 V
- 额定整流电流：1 A（连续）
- 非重复峰值浪涌电流 Ifsm：25 A（单次脉冲）
- 工作结温范围：-65 °C 至 +125 °C
三、性能特点
- 低正向电压降：约 0.45 V（1 A），减小功耗并提升小电流至中电流条件下的转换效率。
- 良好浪涌能力：25 A 的单次峰值浪涌电流使器件在启动或短时突发负载时有较高的可靠性余量。
- 宽工作温度范围：适用于工业级温度环境，满足对温度适应性的需求。
- 表面贴装封装 SOD-123：体积小，便于自动贴装与回流焊工艺，适合空间受限的 PCB 设计。
四、典型应用
- 开关电源与整流电路（输入整流、输出续流）
- 便携式电源管理（电池充放电保护、反向保护）
- 汽车电子（辅助电源、保护电路，注意满足汽车规范时需二次确认）
- LED 驱动与低压功率路径整流
五、封装与热管理
SOD-123 为小型表面贴装封装，有利于高密度 PCB 布局。尽管器件允许 1 A 连续整流电流，设计时应注意 PCB 铜厚、焊盘面积与散热路径，以降低结温。若存在持续高功耗或频繁冲击浪涌，应增加散热面积或选用更大封装/并联方案。
六、选型与焊接注意
- 若电路存在高反向电压或更严格泄漏要求，请选择更高 Vr 或更低 Ir 的系列产品。
- 推荐遵循通用回流焊温度曲线，避免超过器件最高结温并控制峰值温度与时间，以保证长期可靠性。
- 在高温或高湿环境下注意封装与 PCB 的防护，焊接后进行必要的清洗以去除残留焊剂。
七、存储与可靠性建议
- 建议在干燥、常温、避免阳光直射的环境中存放，长时间存储前参照厂家防潮包装（MSL）要求。
- 设计中应考虑反向漏电随温度上升而增大的特性，关键路径可加入温度保护或冗余设计。
总结：SS1040L_R1_00001 以低 Vf、较低体积与良好浪涌能力为亮点，适合对效率和占板面积有要求的一般整流与保护场合。在最终产品中使用前，建议结合实际工作工况评估热管理与长期漏电影响。若需更详细的封装图、绝对最大额定值和典型特性曲线，可从 PANJIT 正式数据手册获取。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
