WMSIC Electronic Components

PANJIT RB551V-30_R1_00001 RB551V

ModelRB551V-30_R1_00001
PackageSOD-323
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT RB551V-30_R1_00001
Type
PANJIT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
RB551V-30_R1_00001
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.019g
Electronic Component
1
Electronic Component
BM0261487522
Current
500mA
Diode
1
Current(Ir)
100uA@20V
(Vf)
470mV@500mA
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB551V-30_R1_00001 产品概述

一、产品简介

RB551V-30_R1_00001 是强茂(PANJIT)生产的一款小尺寸肖特基整流二极管,封装为 SOD-323。该器件在 500mA 直流负载下的典型正向压降仅为 470mV,最大反向耐压为 30V,反向泄漏电流为 100µA(在 20V 时),具有 5A 的非重复峰值浪涌能力,工作结温范围为 -55℃ 至 +125℃。该器件适合用于空间受限的表面贴装应用,兼顾低压降和高速开关特性。

二、主要特性

  • 低正向压降:Vf = 470mV @ IF = 500mA,有助于降低导通损耗、提高能效,适合低压差电源路径。
  • 30V 反向耐压:适用于多数 5V、12V 等低电压电源系统的整流与保护。
  • 低至 100µA 的反向电流(20V):在中低温和中低电压下保持较低漏电,有利于低功耗设计。
  • 良好的浪涌承受能力:Ifsm = 5A(非重复峰值),能承受瞬态冲击电流。
  • 小型 SOD-323 封装:适合高密度 SMT 板面,便于自动化贴装与回流焊工艺。

三、典型应用场景

  • 开关电源的输入/输出整流与续流保护
  • 电池供电设备的电源路径整流与反接保护
  • 低压 DC-DC 转换器与稳压模块中的快速整流
  • 信号线或电源线的极性保护、钳位与防反接电路
  • 汽车电子、家电与消费类电子产品的低压电源管理(在允许的电压/温度条件下)

四、设计要点与注意事项

  • 温度与漏电:肖特基二极管的反向电流会随温度升高显著增加。高温环境下应评估实际漏电对系统待机功耗的影响并进行必要的热管理。
  • 额定电流与散热:虽然器件额定整流电流为 500mA,但在 PCB 和封装的散热条件不同的情况下,结温上升会限制长期电流能力。建议在设计时参考具体热阻数据并适当留有余量。
  • 浪涌能力:5A 的 Ifsm 适合短时浪涌,但不可作为长期过载使用;实际应用中应考虑浪涌脉冲的宽度与频率。
  • 焊接工艺:SOD-323 为常见表贴封装,适用于标准回流焊工艺。贴装与回流时请遵循制造商的焊接温度曲线与湿敏级别要求以保证可靠性。

五、可靠性与质量保证

PANJIT(强茂)为成熟的电子元件厂商,元件通过常规的出厂电气测试与外观检查。RB551V-30_R1_00001 设计用于工业级工作结温范围(-55℃ 至 +125℃),适合苛刻环境下的长期稳定运行。为保证可靠性,建议在量产前做样机验证,包括温度循环、焊接应力和电气老化测试。

六、封装与订购信息

  • 型号:RB551V-30_R1_00001
  • 品牌:PANJIT(强茂)
  • 封装:SOD-323(表面贴装)
  • 主要参数摘要:Vf 470mV@500mA;Vr 30V;Ir 100µA@20V;If = 500mA(整流);Ifsm 5A;Tj -55℃~+125℃。
    订购与生产应用时,请以厂商完整版数据手册为准,确认具体的最大限值、典型曲线与封装尺寸信息,必要时联系供应商索取样片与长期供货保证。

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