WMSIC Electronic Components

PANJIT 1N5408G_AY_00001

Model1N5408G_AY_00001
PackageDO-201AD
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT 1N5408G_AY_00001
Type
PANJIT
Minimum package
1250 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
1N5408G_AY_00001
Electronic Component
1
Package
DO-201AD
Electronic Component
General Purpose Diode
Electronic Component
1.28g
Electronic Component
1
Electronic Component
BM0226260051
Current
3A
Diode
1
Current(Ir)
5uA@1000V
(Vf)
1.2V@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1250

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5408G_AY_00001 产品概述

一、概述

1N5408G_AY_00001 是 PANJIT(强茂)推出的一款通用整流二极管,属于大功率轴向封装整流器系列。器件为硅整流结构,额定整流电流为 3A,直流反向耐压高达 1kV,适用于高电压、较大电流的整流与保护场合。该型号以可靠的电气性能和宽广的工作结温范围,适配工业级电源与控制电路使用要求。

二、主要参数

  • 正向压降 (Vf):1.2 V @ 3 A
  • 直流反向耐压 (Vr):1 kV
  • 整流电流:3 A(持续)
  • 反向电流 (Ir):5 μA @ 1000 V
  • 非重复峰值浪涌电流 (Ifsm):200 A(单次冲击)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 品牌:PANJIT(强茂)
  • 封装:DO-201AD(轴向大功率封装)
  • 型号:1N5408G_AY_00001

三、电气与热性能解读

在 3 A 持续导通时,正向压降约 1.2 V,意味着在满载工作时会有一定的功耗(Pd ≈ If × Vf),需考虑散热设计以防结温上升。反向漏电流在 1000 V 时为 5 μA,说明器件在高压反向状态下漏电较小,但随温度升高漏电会显著增加,应在高温环境下适当降额使用。200 A 的峰值浪涌能力可承受短时启动或故障冲击,但不宜作为长期反复冲击工作条件。

四、封装与安装

DO-201AD 为轴向引脚的金属/玻璃封装,便于通孔焊接和手工装配。该封装热阻相对较低,有利于散热,但在高平均功耗情况下仍建议通过散热片、良好通风或铜箔散热设计来降低结温,保证长期可靠性。

五、典型应用

  • 高压整流电源(整流桥或单相整流)
  • 开关电源的高压侧二极管保护
  • 工业电机驱动与控制电路中的整流与箝位
  • 仪器、测试设备和充电器的高压整流与保护

六、可靠性与使用注意事项

  • 建议在高温或高电压应用中采取降额设计,避免长期在最大额定值下工作。
  • 反向漏流随温度上升显著增大,对高温环境应重点关注。
  • 非重复峰值浪涌电流为单次冲击能力,频繁冲击会损害器件,应在电路中加入限流或浪涌抑制措施(如 NTC、熔丝或 TVS)。
  • 焊接时注意热历程,避免超过器件允许的热应力范围;封装和引脚可靠接地与绝缘保持符合电气安全规范。

七、选型建议与可替代方案

当需要在 1 kV 高压且持续 3 A 的条件下实现可靠整流时,1N5408G_AY_00001 是经济且稳健的选择。若应用要求更快的恢复时间或更低的正向压降,可考虑快速恢复二极管或肖特基级别的替代产品,但需权衡耐压、漏电和成本。购买时请确认品牌与批次,确保器件满足所需的质量与认证标准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.