WMSIC Electronic Components

PANJIT SK56L_R1_00001

ModelSK56L_R1_00001
PackageDO-214AB(SMC)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT SK56L_R1_00001
Type
PANJIT
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
SK56L_R1_00001
Electronic Component
1
Package
DO-214AB(SMC)
Electronic Component
Schottky Diode
Electronic Component
0.301g
Electronic Component
1
Electronic Component
BM0230804020
Current
5A
Diode
1
Current(Ir)
500uA@60V
(Vf)
500mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SK56L_R1_00001 产品概述

一、概述

SK56L_R1_00001 是强茂(PANJIT)出品的一款肖特基整流二极管,封装为 DO-214AB(SMC)。器件面向中高电流整流与自由轮回路,特点为低正向压降、较高瞬态浪涌能力和宽工作结温。典型应用包括开关电源输出整流、DC-DC 转换器、续流二极管、反向极性保护与电池充放电管理等。

二、主要规格

  • 正向压降 Vf:500 mV @ 5 A
  • 直流反向耐压 Vr:60 V
  • 连续整流电流 If:5 A
  • 反向漏电流 Ir:500 µA @ 60 V
  • 非重复峰值浪涌电流 Ifsm:100 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 品牌 / 封装:PANJIT(强茂) / DO-214AB (SMC)

三、性能特点

  • 低正向压降:在大电流下可降低导通损耗,提高系统效率。
  • 快速开关、低反向恢复:肖特基结构使开关损耗和电磁干扰较传统整流硅二极管更低。
  • 良好的浪涌承受力:100 A 的单次峰值浪涌能力适合带有短时冲击电流的场合。
  • 温度相关的漏电流:标称 Ir=500 µA 在 Vr=60 V 条件下,随结温上升漏电流会显著增加,需在热设计中考虑。

四、典型应用

  • 开关电源(SMPS)输出整流
  • DC-DC 转换器与电源模块输出
  • 电机驱动与续流二极管
  • 太阳能、LED 驱动、电池管理与充电器
  • 反向极性保护与浪涌抑制电路(注意系统最高电压)

五、封装与热管理

DO-214AB(SMC)为大功率表面贴装封装,便于于 PCB 上实现良好散热。建议采用足够的铜箔面积和热过孔增强散热;在长期高电流或高环境温度条件下,应评估结温并必要时增加散热片或改善风冷。器件最高结温 150 ℃ 为可靠性上限,不应长期靠近此温度运行。

六、选型与设计注意事项

  • 若系统存在高温或高静态电压条件,需考虑反向漏电流随温度增大带来的影响;高温下漏电可能显著增加损耗或触发保护电路。
  • 对需要承受汽车负载突波(load dump)或更高工作电压的应用,建议选用更高 Vr 规格的器件。
  • 设计 PCB 时注意良好散热、短的走线与足够的焊盘,以降低寄生电阻和热阻。并在浪涌或切换瞬态处评估应力,必要时并联限流元件或吸收网络。

七、使用建议

  • 输出整流时配合适当的输入滤波与回路布局,能充分发挥低 Vf 带来的效率优势;
  • 在高温场合测试实际漏电并留有裕量;
  • 焊接采用厂家推荐的回流温度曲线,避免超过封装和内部材料的耐热极限。

SK56L_R1_00001 以其平衡的电流能力、较低正向压降和便于散热的 SMC 封装,适合多数中功率电源与保护场合。选型时结合具体工作电压、环境温度与浪涌特性进行验证以保证长期可靠性。

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