Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT MB420G_R1_000A1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT MB420G_R1_000A1
- Type
- PANJIT
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- MB420G_R1_000A1
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.37g
- Electronic Component
- 1
- Electronic Component
- BM0264240999
- Current
- 4A
- Diode
- 1
- (Vf)
- 760mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 800
- Voltage Rating(Vr)
- 200V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB420G_R1_000A1 产品概述
一、产品简介
MB420G_R1_000A1 为 PANJIT（强茂）出品的一款独立式肖特基势垒二极管，封装为 SMC（DO-214AB）。该器件采用肖特基结构，具有低正向压降与极快切换特性，适用于开关电源、整流与保护类场合，提供了在中等电流和高电压工作条件下的可靠性能。
二、主要参数
- 二极管数量：1 个独立式
- 正向压降 (Vf)：760 mV @ 2 A
- 直流反向耐压 (Vr)：200 V
- 额定整流电流：4 A（连续）
- 非重复峰值浪涌电流 (Ifsm)：100 A
- 工作结温范围：-55 ℃ ~ +150 ℃
- 封装：SMC
- 类型：肖特基二极管
三、主要特性与优势
- 低正向压降：760 mV @2 A 的典型 Vf 有助于降低导通损耗，提升整流效率及系统总效率。
- 快速响应：肖特基二极管无显著反向恢复，适合高频开关环境，可减少电磁干扰与开关损耗。
- 良好浪涌能力：100 A 的峰值浪涌电流允许器件承受瞬态冲击，适合启动与短时过载场景。
- 宽温度范围：-55 ℃ 至 +150 ℃ 的结温范围保证在苛刻环境下的长期可靠性。
四、典型应用
- 开关电源（SMPS）输出整流
- DC-DC 降压/升压转换器
- 续流/续流二极管（freewheeling）
- 逆/反接保护及续流保护电路
- 充电器、适配器、光伏汇流逆变器等电力电子设备
五、设计与散热建议
- 封装为 SMC，须采用合适的 PCB 铜箔面积与热过孔（vias）增强散热，尽量靠近散热铜面布线以降低结壳温差。
- 在高平均电流或高环境温度条件下，应按实际工况对额定电流进行降额（derating），并参考厂商完整数据手册中的 RθJA / RθJC 值进行热设计。
- 注意肖特基二极管的反向漏电随温度和反向电压显著上升，系统需评估最大工作温度下的漏电影响。
六、选型要点与注意事项
- 若系统需要更低的导通损耗，可比较同电压等级更低 Vf 的型号；若需要更高连续电流，则考虑更高额定电流或并联方案并做好热平衡。
- 验证峰值浪涌、重复浪涌与反向耐压在目标应用中的裕量，避免长时间在极限条件下工作。
- 参考 PANJIT 官方数据手册获取完整电气特性曲线、封装尺寸与推荐 PCB 布局。
七、封装与采购信息
- 封装：SMC（DO-214AB），适配常见 SMC 焊盘与回流焊工艺。
- 品牌：PANJIT（强茂）。
- 采购时请确认完整型号 MB420G_R1_000A1、批次与供货状态，并索取最新规格书与质量保证文件以满足认证与可靠性要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
