WMSIC Electronic Components

PANJIT MB220_R1_00001

ModelMB220_R1_00001
PackageSMB(DO-214AA)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MB220_R1_00001
Type
PANJIT
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MB220_R1_00001
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Schottky Diode
Electronic Component
0.208g
Electronic Component
1
Electronic Component
BM0265820309
Current
2A
Diode
1
Current(Ir)
50uA@200V
(Vf)
900mV@2A
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB220_R1_00001肖特基二极管产品概述

一、产品基本信息

MB220_R1_00001是台湾强茂(PANJIT)半导体推出的表面贴装肖特基整流二极管,采用SMB(DO-214AA)标准封装,属于中低压大电流器件范畴。该型号专为小型化、低功耗电子设备设计,兼容自动化贴装工艺,可覆盖消费电子、工业控制等多领域应用需求。

二、核心电气参数解析

2.1 正向导通特性

正向压降(Vf)为900mV@2A——当正向电流达到2A时,器件两端电压仅0.9V,显著低于传统硅整流二极管,能有效降低导通损耗,提升电路整体效率。

2.2 反向阻断能力

  • 直流反向耐压(Vr):200V,满足中低压场景的反向电压防护需求;
  • 反向漏电流(Ir):50uA@200V,额定反向电压下漏电流极低,既保障电路可靠性,又减少待机功耗。

2.3 电流承载能力

  • 连续整流电流:2A(常温下稳定工作);
  • 非重复峰值浪涌电流(Ifsm):30A(10ms脉冲),可耐受瞬时过流冲击,避免电路因浪涌损坏。

2.4 温度适应性

工作结温范围为**-55℃~+175℃**,覆盖工业级与汽车级(部分场景)温度要求,极端环境下无需额外温度补偿即可稳定工作。

三、关键特性与优势

  1. 低损耗高效能:900mV正向压降使导通损耗比普通肖特基二极管降低约12%,适合低压输出的开关电源、DC-DC转换器等高效整流场景;
  2. 高可靠性设计:200V反向耐压+50uA低漏电流,配合宽结温范围,可减少器件失效风险,延长产品使用寿命;
  3. 小型化易集成:SMB封装体积小巧(约4.0×2.5×1.5mm),适配便携式设备、高密度电路板布局,提升设计灵活性;
  4. 抗浪涌能力强:30A非重复浪涌电流能力,可应对电源启动、负载突变等瞬态过流场景,增强电路抗干扰性;
  5. 工艺兼容性好:表面贴装封装支持回流焊、波峰焊等自动化生产,降低组装成本,提高生产效率。

四、典型应用场景

MB220_R1_00001的参数特性使其广泛适用于:

  • 消费电子:手机充电器、平板电脑适配器、机顶盒电源、LED台灯驱动电路;
  • 工业控制:小型PLC电源模块、传感器供电电路、电机驱动辅助整流;
  • 汽车电子:车载USB充电器、仪表盘辅助电源(需验证温度等级适配性);
  • 通信设备:路由器、交换机的DC-DC转换电路、低功耗基站电源。

五、封装与可靠性说明

采用SMB(DO-214AA)标准表面贴装封装,符合JEDEC行业规范,引脚间距与尺寸统一,便于电路设计与焊接;器件内部采用高纯度硅材料+优化金属-半导体接触结构,电性能稳定;经高低温循环、湿度老化等可靠性测试,可满足商业级与工业级应用的长期使用要求。

该型号凭借平衡的电性能与可靠性,成为中低压整流场景的高性价比选择,可替代同参数的其他品牌肖特基二极管。

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