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PANJIT MMSZ5222B_R1_00001
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT MMSZ5222B_R1_00001
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- MMSZ5222B_R1_00001
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- (Zzk)
- 1.25kΩ
- (Zzt)
- 30Ω
- Electronic Component
- BM0227309735
- Diode
- 1
- Current(Ir)
- 100uA@1V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 2.38V~2.63V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ5222B_R1_00001 产品概述
一、产品简介
MMSZ5222B_R1_00001 为 PANJIT（强茂）生产的独立式稳压二极管，标称稳压值 2.5V，实际稳压范围 2.38V ～ 2.63V。器件采用 SOD-123 小型封装，适合于空间受限且需稳压参考或钳位保护的低功耗电路。
二、主要电气参数
- 稳压值（标称）：2.5V
- 稳压值范围：2.38V ～ 2.63V
- 反向电流 Ir：100μA @ 1V
- 耗散功率 Pd：500mW（在规定的散热条件下）
- 阻抗 Zzt：30Ω
- 阻抗 Zzk：1.25kΩ
- 工作结温范围：-55℃ ～ +150℃
三、典型应用场景
适用于低压参考源、电平钳位、基准偏置、过压保护与信号整形等场合，尤其适合便携设备、传感器前端与低功耗模拟电路中作为稳定参考或保护元件使用。
四、封装与热管理建议
SOD-123 封装体积小，散热能力有限。实际使用时应注意热耗散与结温上升：
- 设计时需在二极管前串联限流电阻以控制工作电流与功耗；
- 在 PCB 布局上增加铜箔散热面积或热过孔以改善散热；
- 在高环境温度或连续大电流条件下按厂方热阻与结温公式进行热设计与降额。
五、使用注意事项与选型建议
选型时以稳压值范围、反向漏电和动态阻抗为主要考量。若电路对基准精度要求较高，应考虑温漂与测试电流对稳压值的影响；对高能浪涌或高功耗场合，建议选用更大功率或封装更佳的稳压二极管。最终设计请参考 PANJIT 官方数据手册以获得完整的电气特性与热参数。
该器件以其小尺寸和稳定的 2.5V 基准特性，适合廉价、空间受限且对精度要求中等的设计应用。
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