WMSIC Electronic Components

PANJIT PG600M_AY_10001

ModelPG600M_AY_10001
PackageP600
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT PG600M_AY_10001
Type
PANJIT
Minimum package
400 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
PG600M_AY_10001
Electronic Component
1
Package
P600
Electronic Component
General Purpose Diode
Electronic Component
2.46g
Electronic Component
1
Electronic Component
BM0230043182
Current
6A
Diode
1
Current(Ir)
1uA
(Vf)
1.1V@6A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
400

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PANJIT PG600M_AY_10001 产品概述

一、产品简介

PG600M_AY_10001 是强茂(PANJIT)推出的一款通用整流二极管,采用 P600 封装,面向高电压整流与防逆流保护场合。该器件在高电流与高电压条件下仍能保持低反向泄漏,适用于中小功率开关电源、整流桥、逆变器及电机驱动等应用。

二、主要电气参数

  • 正向压降 (Vf):1.1 V @ 6 A
  • 直流反向耐压 (Vr):1000 V
  • 反向电流 (Ir):1 μA(常温)
  • 非重复峰值浪涌电流 (Ifsm):300 A
  • 工作结温范围:-55 ℃ ~ +150 ℃

以上参数表明器件在 1 kV 阈值下具有良好的阻断能力,同时在额定直流电流 6 A 时正向损耗可控,能承受短时大浪涌电流。

三、关键特性与优势

  • 高耐压:1 kV 反向耐压适合高压整流与隔离电源输出级使用。
  • 低反向泄漏:1 μA 的低 Ir 有利于提高系统待机效率与减少漏电引起的误动作。
  • 抗浪涌能力强:300 A 的 Ifsm 能够保证器件在启动、短路或负载突变时的瞬态可靠性。
  • 宽温度范围:-55 ℃ 至 +150 ℃ 的结温范围满足工业级和严苛环境的可靠性需求。

四、典型应用场景

  • 开关电源(SMPS)整流二极管与续流二极管
  • 高频逆变器与光伏并网的保护元件
  • 工业电机驱动、伺服放大器的整流与吸收电路
  • 电池充电器、HV 电源模块及电源滤波回路

五、设计与安装注意事项

  • 热管理:尽管器件能承受短时大浪涌,长期工作应根据实际负载进行散热设计,必要时采用散热片或良好线路铜箔散热。
  • 电流与功耗评估:在 6 A 工作点,应关注正向压降引起的功耗 P = Vf × I,并据此设计散热和 PCB 走铜。
  • 浪涌与保护:Ifsm 为非重复峰值浪涌能力,若应用存在频繁或重复浪涌,需采用限流、慢熔断器或浪涌吸收电路来保护二极管。
  • 环境与热沉:高温环境下应适当降低连续工作电流以延长寿命并避免热失稳。

六、可靠性与测试建议

  • 建议在产品验证阶段进行功率循环、温度循环与高温高湿测试,验证在预期工况下的长期可靠性。
  • 对于关键应用,推荐进行浪涌重复寿命评估与焊接耐热性测试,确保封装与焊接工艺满足整机可靠性要求。

七、包装与订购信息

品牌:PANJIT(强茂)
型号:PG600M_AY_10001
封装:P600
在采购时请确认批次与规格一致,并向供应商索取器件规格书与可靠性测试报告以便做二次验证。

八、选型建议

若系统工作电压接近 1 kV 并且需要 4–6 A 连续整流,PG600M_AY_10001 是一款性价比较高的选择;若应用存在长期高频浪涌或更高效率需求,可考虑低 Vf 或肖特基型器件,但需权衡耐压与反向漏电的折衷。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.