WMSIC Electronic Components

PANJIT 1SMA4753_R1_00001

Model1SMA4753_R1_00001
PackageSMA(DO-214AC)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT 1SMA4753_R1_00001
Type
PANJIT
Minimum package
1800 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
1SMA4753_R1_00001
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Zener Diode
Electronic Component
0.109g
Electronic Component
1
(Zzk)
1kΩ
(Zzt)
50Ω
Electronic Component
BM0264878185
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
1W
Electronic Component
34.2V~37.8V
Electronic Component
50℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4753_R1_00001 产品概述

一、产品简介

1SMA4753_R1_00001 为 PANJIT(强茂)出品的一颗独立式稳压二极管,封装为 SMA(DO-214AC)。标称稳压值 36V,稳压范围 34.2V~37.8V,适合作为中高压小功率稳压与钳位元件。反向漏电流规格为 100nA(在 27.4V 时),结温工作范围为 -50℃ ~ +150℃,最高耗散功率 Pd = 1W。

二、主要电气性能

  • 标称稳压:36V,允许范围 34.2V~37.8V。
  • 反向漏电 Ir:100nA @ 27.4V,低漏电利于高阻抗偏置场合。
  • 耗散功率 Pd:1W,适用于小功率稳压或瞬态吸收。
  • 小信号阻抗 Zzt:50Ω(测试工况下),表示在中等偏流时的动态阻抗较低;
  • 低流阻抗 Zzk:1kΩ,表明在低电流或拐点附近稳压性能下降明显。
    以上参数说明该器件在数 mA 级工作电流时具有较好稳压效果,但在微安级下稳压精度会变差。

三、功率与电流计算(实用指导)

在稳压工作时应保证二极管耗散功率不超限:Iz_max ≈ Pd / Vz = 1W / 36V ≈ 27.8mA。因此设计时应选择系列限流电阻 R,使通过二极管的电流 Iz 在安全范围内。常用经验工作电流可选 5–15mA,以兼顾稳压精度与热耗散。计算公式:

  • R = (Vin_min − Vz) / Iz
  • Pd_actual = (Vin − Vz) × Iz
    设计时同时考虑最坏工况(最高 Vin 与最高环境温度)。

四、封装与可靠性

SMA(DO-214AC)为贴片封装,适合回流焊与自动贴装。封装对热散能力有限,建议通过 PCB 铜箔散热和热导通孔改善热量释放。结温上限 150℃,长期使用时需参照 Pd 与环境温度关系做功率降额处理。

五、典型应用场景

  • 中高压基准/偏置源(需小电流偏置的放大电路)
  • 输入/输出端的电压钳位与浪涌吸收(配合限流电阻)
  • 保护电路中作稳定点或参考电压器件

六、选型与使用注意

  • 若电路工作在极低电流(微安级),请注意 Zzk 较高会导致稳压偏移,必要时选择低电流专用参考器件。
  • 长时间高温工作需降低电流以防 Pd 超限并延长寿命。
  • 贴片焊接按厂商回流曲线处理,避免超过结温限制。
  • 实际系统中推荐在样机上验证稳压精度、温漂及热分布,确保长期可靠。

以上为 1SMA4753_R1_00001 的关键特性与工程应用建议,便于在电源管理和保护设计中快速评估与部署。若需更详尽的温升曲线、典型特性曲线或封装尺寸图,可进一步提供数据手册索引或样片测试结果。

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