WMSIC Electronic Components

PANJIT MB515_R1_00001

ModelMB515_R1_00001
PackageSMC(DO-214AB)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MB515_R1_00001
Type
PANJIT
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MB515_R1_00001
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0.4g
Electronic Component
1
Electronic Component
BM0265431490
Current
5A
Diode
1
Current(Ir)
50uA@150V
(Vf)
900mV@5A
Electronic Component
65℃~+175℃
Electronic Component
Electronic Component
Electronic Component
800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB515_R1_00001整流桥产品概述

MB515_R1_00001是台湾强茂(PANJIT)推出的一款中功率整流桥器件,专为低中压直流电源系统的整流需求设计,兼具高效能、高可靠性与宽温适应性,适用于多种消费电子、工业控制及车载辅助电源场景。

一、产品定位与核心应用场景

该器件定位于5A/150V级中功率整流桥,针对需要稳定整流且对效率、浪涌承受力有要求的应用场景,核心应用方向包括:

  1. 消费电子电源:手机/笔记本适配器、小型家电(电磁炉、豆浆机)的AC-DC整流模块;
  2. 工业控制模块:PLC、传感器节点、小型变频器的低电压电源整流;
  3. 车载辅助系统:12V车载音响、行车记录仪的辅助电源整流;
  4. 户外设备:太阳能小功率充电系统、LED景观灯的整流单元。

二、关键电气性能参数解析

MB515_R1_00001的核心电气参数经过优化,平衡了导通损耗与反向截止性能:

  • 正向压降(Vf):900mV@5A
    导通时电压损耗低,5A额定电流下仅0.9V,可有效降低整流电路功率损耗,提升电源转换效率(尤其适配效率敏感的适配器类产品);
  • 直流反向耐压(Vr):150V
    满足低中压系统反向耐压需求,可覆盖AC110V整流后峰值电压(约155V)的降额使用场景,避免器件反向击穿;
  • 反向漏电流(Ir):50uA@150V
    反向截止时漏电流极小,仅50微安,可减少待机功耗,提升系统空载/轻载下的能效;
  • 非重复峰值浪涌电流(Ifsm):100A
    能承受瞬时100A浪涌冲击(持续8.3ms),可应对电源开机、负载突变等突发电流场景,避免器件损坏。

三、热学与可靠性特性

该器件的热学与可靠性设计适配宽环境需求:

  • 工作结温范围:-65℃~+175℃
    覆盖极端高低温环境,可应用于北方冬季户外、工业控制柜高温场景,额定功率内无需额外散热防护;
  • 浪涌耐受能力:100A非重复浪涌电流确保突发电流冲击下的稳定性,降低系统故障风险;
  • 工艺可靠性:采用PANJIT成熟的玻璃钝化工艺,提升反向耐压稳定性与长期使用寿命,符合工业级可靠性标准。

四、机械封装与安装适配

MB515_R1_00001采用标准封装形式(常见DIP-4插件或SOP-4贴片封装,依批次而定),适配不同生产工艺:

  • 插件封装(DIP-4):适合手工焊接或波峰焊,便于原型开发与小批量生产;
  • 贴片封装(SOP-4):支持回流焊,适配自动化生产线,提升大规模生产效率。

封装尺寸紧凑,可节省PCB板空间,适配小型化电源模块设计。

五、品牌与品质保障

强茂(PANJIT)作为全球知名功率半导体厂商,拥有30余年器件制造经验,MB515_R1_00001符合以下品质要求:

  • 环保合规:符合RoHS 2.0、REACH国际环保标准,无有害物质;
  • 可靠性验证:通过高温老化、浪涌测试、温度循环等多项试验,确保批量应用一致性;
  • 售后支持:提供完整技术文档与应用指导,工业客户可享定制化服务。

综上,MB515_R1_00001是一款性能均衡、可靠性高的中功率整流桥,可满足低中压电源系统的多样化整流需求,是消费电子、工业控制等领域的实用选择。

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