WMSIC Electronic Components

PROD PSTMAA252012-150MB PSTMAA252012

ModelPSTMAA252012-150MB
Package1008
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSTMAA252012-150MB
Type
PROD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSTMAA252012-150MB
Electronic Component
1
Package
1008
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.063g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0257711558
Current
1.4A
Resistor(DCR)
565mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSTMAA252012-150MB 产品概述

一、产品简介

PSTMAA252012-150MB 是谱罗德(PROD)推出的一款扁平线一体成型片式电感,标称电感量 15 µH(±20%)。器件为表面贴装封装,封装代号 1008,典型外形尺寸约 2.5 × 2.0 × 1.2 mm(以实际样片为准)。该器件面向中低频率电源滤波与能量传输场景,适用于空间受限的消费电子与工控场合。

二、主要电气参数

  • 电感值:15 µH,公差 ±20%
  • 额定电流:1.4 A
  • 饱和电流(Isat):1.4 A(在该电流水平下电感将接近饱和,注意电感量下降)
  • 直流电阻(DCR):565 mΩ
    这些参数表明器件在额定电流下的直流损耗较高(P = I^2·DCR,若 I = 1.4 A,损耗约 1.11 W),建议在设计时考虑热量和效率影响。

三、结构与特点

  • 扁平线绕制:导线扁平化设计,有利于减小高度与稳定自谐振特性。
  • 一体成型(Molded):提高机械强度和可焊性,降低振动敏感性与环境侵入风险。
  • SMT 贴片封装:适配自动贴装与回流焊工艺,生产效率高。

四、典型应用场景

  • 开关电源(DC-DC)输出电感(中低电流、小体积场合)
  • 电源输入/输出滤波(对噪声抑制有一定效果)
  • 电源管理模块、便携设备、工业控制板上用于滤波与能量储存

五、设计与选型建议

  • 电流裕量:由于 Isat 与额定电流相同,实际设计应留有裕度,建议连续工作电流控制在 50%–80% 额定值范围以避免饱和与过热(典型建议 ≤ 0.8–1.0 A,视系统允许温升而定)。
  • 考虑损耗:直流电阻偏大时会带来较高 I^2R 损耗,影响效率与温升,若对效率要求高应选择 DCR 更低的型号或并联器件。
  • 高频性能:±20% 公差适用于通用滤波场景,不适合对精确谐振要求高的应用。
  • 热管理:在封装密集或散热受限板子上,需验证回流后温升并进行必要的散热设计或布局优化。

六、可靠性与封装建议

  • 推荐用标准 SMT 回流工艺(遵循供应商回流曲线),避免超温或反复焊接。
  • 常见可靠性试验:高温存储、温度循环、焊接热冲击与机械振动试验。
  • 封装 1008 适合自动贴装,焊盘设计请参考供应商推荐焊盘图以保证焊接质量与电气性能。

七、选型参考与替代

在需要更低 DCR、更高持续电流或更紧密电感公差时,可考虑同类封装中 DCR 更低或 Isat 更高的型号;若空间允许,也可采用体积更大但损耗更低的器件以提高效率。下单时请以完整料号 PSTMAA252012-150MB 与谱罗德(PROD)官方规格书为准。

如需该型号的详细频率特性曲线、温升数据或典型应用电路(例如在升降压调节器中的典型布局与波形),可提供电路参数后进一步给出针对性建议与仿真数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.