WMSIC Electronic Components

PROD PSPMAA0605H-220M-ANP PSPMAA0605H

ModelPSPMAA0605H-220M-ANP
PackageSMD,7.1x6.6mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA0605H-220M-ANP
Type
PROD
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA0605H-220M-ANP
Electronic Component
1
Package
SMD,7.1x6.6mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.573g
Inductor
22uH
Electronic Component
1
Electronic Component
BM0257349652
Current
3A
Resistor(DCR)
135mΩ
Electronic Component
Electronic Component
Electronic Component
1000
and Current(Isat)
5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA0605H-220M-ANP — 5A 功率电感器产品概述

一、产品简介

PSPMAA0605H-220M-ANP 是谱罗德(PROD)推出的一款表面贴装功率电感器,封装尺寸为 SMD 7.1 × 6.6 mm。标称电感量为 22 μH,容差 ±20%,适用于中低频开关电源滤波与储能场合。该器件强调较高的饱和电流能力(Isat 约 5A)和额定连续电流 3A 的应用能力,适合空间受限但需承载数安培电流的功率电路。

二、主要参数(摘要)

  • 型号:PSPMAA0605H-220M-ANP
  • 品牌:PROD(谱罗德)
  • 电感值:22 μH,容差 ±20%
  • 额定连续电流(Irated):3 A
  • 饱和电流(Isat):5 A(典型定义为电感值下降到一定比例时的电流)
  • 直流电阻(DCR):135 mΩ(0.135 Ω)
  • 封装:SMD,外形尺寸 7.1 × 6.6 mm

三、功能与特点

  • 紧凑体积:7.1 × 6.6 mm 的 SMD 封装便于表面贴装生产与自动化装配,适合对体积有要求的电源模块。
  • 大电流能力:5A 的饱和电流使其在短时或启动冲击电流情况下仍能保持电感,提升系统稳定性。
  • 适配中功率场合:22 μH 的较大电感值可有效降低开关转换中的电流纹波,适合某些降压/滤波应用。
  • 商用级制造与一致性:谱罗德品质控制,适合量产与批量应用。

四、典型应用场景

  • 开关稳压电源(DC-DC)—— 切换频率较低或对电流纹波要求较高的点负载。
  • 电源输出滤波器—— 降低输出纹波与 EMI 干扰。
  • LED 驱动与恒流源—— 需要较大储能且承受脉冲电流的场合。
  • 电池管理与便携设备电源前端滤波。
  • 工业与通信电源模块中的电感储能单元。

五、选型与使用建议

  • 电流选择:器件标称额定连续电流为 3A,但为保证长期可靠性与温升控制,建议在实际设计中按额定电流的 70%–80% 选型(约 2.1–2.4 A)以留有裕量。
  • 注意功耗:直流损耗(铜损)可按 P = I^2 × DCR 计算:
    • 在 3 A 时,P ≈ 3^2 × 0.135 ≈ 1.215 W;
    • 在 5 A 时,P ≈ 5^2 × 0.135 ≈ 3.375 W。 该功耗在小封装下会导致明显的温升,设计时需考虑散热与温度限制。
  • 饱和特性:Isat 表示在较高直流偏置下电感开始显著下降,对高电流直流分量较大的应用应关注电感下降对环路稳定性的影响。
  • 电感容差 ±20%:如果电路对电感值精度敏感(如特定滤波/谐振网络),需考虑容差带来的影响或在系统层面做补偿。

六、PCB 布局与散热建议

  • 布局靠近功率器件:将电感与开关管、电容组成的回路最小化以减小环路电感与辐射。
  • 热管理:考虑在电感底下或周围设计铜箔散热区与过孔(thermal vias)以帮助散热,避免电感长时间受高温。
  • 磁耦合隔离:同一电路板上避免将多个电感彼此并列放置过近,以免磁耦合影响性能。
  • 焊盘与贴装:遵循厂方推荐焊盘尺寸与回流焊工艺(无铅回流曲线),避免过度热循环或机械应力。

七、可靠性与焊接说明

  • 建议使用标准无铅回流焊工艺,参照 JEDEC 回流曲线进行温度曲线控制,避免超温或过快降温导致机械应力。
  • 在高温、高湿及振动场合需进行额外可靠性验证。长期工作在高负载下会加速绕组与磁芯老化,应在设计中留有安全余量。

八、注意事项与常见问题

  • 直流电阻较高时带来的功耗不可忽视,若系统要求低损耗或高效率,请评估是否需选用更低 DCR 的型号。
  • 若工作频率较高(MHz 级),请确认电感在该频带的等效损耗与频率响应,因为高频损耗可能增加。
  • 若需并联使用多只电感提高电流承载能力或减小 DCR,请注意并联不等于完全共享电流,需验证电流分配与热特性。

如需进一步的阻抗曲线、温升数据或推荐的 PCB 焊盘图和回流曲线,可联系谱罗德(PROD)技术支持获取详细的数据手册与应用指南。

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