WMSIC Electronic Components

PROD PSPMAA0603-4R7M-ANF PSPMAA0603

ModelPSPMAA0603-4R7M-ANF
PackageSMD,6.6x7.1x3mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA0603-4R7M-ANF
Type
SMD, 6.6X7.1X3MM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA0603-4R7M-ANF
Electronic Component
1
Package
SMD,6.6x7.1x3mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.03g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0257625980
Current
5.5A
Resistor(DCR)
40mΩ
Electronic Component
Electronic Component
Electronic Component
1000
and Current(Isat)
10A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA0603-4R7M-ANF 产品概述

一、产品简介

PSPMAA0603-4R7M-ANF 是谱罗德(PROD)出品的一款表贴功率电感,标称电感值 4.7 μH,公差 ±20%。封装为 SMD,外形尺寸 6.6 × 7.1 × 3.0 mm,适用于空间受限但要求较高电流承载能力的电源应用。该器件强调高饱和电流与相对较低的直流电阻,适配中高功率开关电源和电源管理模块。

二、主要电气参数

  • 电感值:4.7 μH(±20%)
  • 额定电流(Irms):5.5 A
  • 饱和电流(Isat):10 A(电感值在该电流下显著下降)
  • 直流电阻(DCR):40 mΩ
  • 封装:SMD,尺寸 6.6×7.1×3.0 mm

说明:在额定电流工作点下的铜损约为 P = I^2·DCR = 5.5^2·0.04 ≈ 1.21 W,电压降约为 V = I·DCR ≈ 0.22 V。设计时应考虑这些损耗对温升和效率的影响。

三、典型应用场景

  • 同步降压(Buck)/ 升压(Boost)DC-DC 转换器
  • 多相电源和点对点(POL)模块
  • LED 驱动和电机驱动电源
  • 工业、通信与消费电子领域的电源管理场合(需按具体环境与认证要求选型)

四、产品特点与优势

  • 高饱和电流:Isat 达到 10 A,可在短时或突发负载下保持磁通不过早饱和,提升系统稳态裕度。
  • 紧凑封装:6.6×7.1×3.0 mm 的 SMD 体积利于高密度 PCB 布局。
  • 中等 DCR:40 mΩ 在保证电流能力的同时兼顾成本与体积,适合效率/尺寸平衡的设计。

五、选型与使用建议

  • 电流裕度:推荐工作电流低于额定电流以控制温升,设计时留有饱和裕度(通常取 Irated 的 70% 左右,或参考具体应用的峰值电流与占空比)。
  • 温升评估:基于铜损估算稳态温升,并结合 PCB 散热、周围器件热源进行热仿真或实测。
  • 频率匹配:适用于常见开关频率范围的中高频开关电源;高频设计请参考厂商频率特性曲线以评估有效电感值随频率的变化。
  • 布局与焊接:电感应靠近开关器件和整流/滤波节点布置,走线短而粗,便于降低回路阻抗与 EMI。采用厂商推荐的焊盘布局与标准无铅回流焊工艺。

六、可靠性与处理

  • 存储与清洁:遵循普通 SMD 器件的防潮与清洗规范,回流后避免超出温度循环规格。
  • 机械可靠性:注意在高速贴装与震动环境中采取可靠固定与测试,避免过度弯曲基板或在焊接后施加机械应力。
  • 测试建议:在样机阶段进行温升、耐热、寿命与饱和特性测试,特别关注在最大占空比与突发电流条件下的表现。

七、获取更多信息

欲获得完整电气特性曲线、温升曲线、封装图纸和推荐焊盘,请参考制造商规格书或联系谱罗德授权渠道。样片评估与批量采购前,建议通过实际电路验证以确认在目标工况下的性能与可靠性。

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