Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PROD PSPMAA0603-2R2M-ANP PSPMAA0603
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PROD PSPMAA0603-2R2M-ANP
- Type
- PROD
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PROD
- Electronic Component
- PSPMAA0603-2R2M-ANP
- Electronic Component
- 1
- Package
- SMD,6.6x7.1x3mm
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.99g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Electronic Component
- BM0257711548
- Current
- 8A
- Resistor(DCR)
- 20mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- and Current(Isat)
- 14A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PSPMAA0603-2R2M-ANP 产品概述
一、产品简介
PSPMAA0603-2R2M-ANP 是谱罗德（PROD）推出的一款高电流功率贴片电感，电感值为 2.2µH，公差 ±20%。器件采用 SMD 封装（尺寸 6.6×7.1×3.0mm），针对高密度开关电源及电源管理场景优化设计，兼顾低直流损耗与高磁饱和能力，适合对电流承载和效率有较高要求的应用。
二、主要参数
- 电感值：2.2µH（±20%）
- 额定电流：8A
- 饱和电流（Isat）：14A（定义为电感下降一定比例时的电流）
- 直流电阻（DCR）：20mΩ
- 封装：SMD，尺寸 6.6×7.1×3.0 mm
- 型号：PSPMAA0603-2R2M-ANP；品牌：PROD（谱罗德）
三、产品特点
- 高频性能良好，适应典型 DC-DC 开关频率范围；
- 低 DCR（20mΩ），降低导通损耗，提高系统效率；
- 高饱和电流（14A），在峰值电流环境下仍能保持稳定电感值；
- 紧凑封装（6.6×7.1×3mm），便于高密度布板与自动化贴装。
四、典型应用
- 同步整流或非同步降压（Buck）转换器电感；
- 多相电源模块与电源管理 IC 输出滤波；
- LED 驱动与车载供电系统（需按实际环境温度与认证确认）；
- 工业电源、服务器电源与通信设备等高电流场景。
五、选型要点与注意事项
- 峰值电流应低于饱和电流 Isat（14A），并留有裕量以避免电感急剧下降；
- 按系统工作频率核算容性与电感的截止特性，避免过度电流纹波导致温升；
- DCR 会影响效率与发热，设计时应将 20mΩ 的功耗考虑在热平衡计算内；
- 环境温度和散热条件会影响额定电流，必要时做热仿真或实测降额。
六、封装与焊接
- SMD 封装，适配自动贴装与回流焊工艺；
- 推荐根据 PCB 尺寸与电流走向优化铜箔厚度与散热通道；
- 焊接时遵循常规回流温度曲线，避免长时间高温或机械应力。
七、可靠性与包装
- 产品设计侧重高电流可靠性，适合连续大电流工作场景；
- 常见包装形式为卷带（Tape & Reel），便于 SMT 生产线使用；
- 订购时请注明型号 PSPMAA0603-2R2M-ANP 与所需数量，必要时可请求样品与电气性能曲线用于验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
