WMSIC Electronic Components

PROD PSPMAA0803H-470M-ANP PSPMAA0803H

ModelPSPMAA0803H-470M-ANP
PackageSMD,8.5x8mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA0803H-470M-ANP
Type
PROD
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA0803H-470M-ANP
Electronic Component
1
Package
SMD,8.5x8mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.41g
Inductor
47uH
Electronic Component
1
Electronic Component
BM0227783361
Current
2A
Resistor(DCR)
310mΩ
Electronic Component
Electronic Component
Electronic Component
1000
and Current(Isat)
3.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA0803H-470M-ANP 产品概述

一、产品简介

PSPMAA0803H-470M-ANP 是谱罗德(PROD)推出的一款功率贴片电感,标称感量 47 µH,公差 ±20%,额定直流电流 2 A,饱和电流(Isat)3.5 A,直流电阻(DCR)约 310 mΩ。封装为 SMD,外形尺寸约 8.5 × 8.0 mm,适用于中等功率的开关电源与电源滤波场景。

二、主要电气参数与含义

  • 感量:47 µH(±20%),实际工作感量会随电流与频率变化,公差范围约 37.6 µH 至 56.4 µH。
  • 额定电流:2 A,指在允许温升与特性下降范围内的连续直流电流能力。
  • 饱和电流:3.5 A,超过该值时电感量显著下降,可能导致电路失稳或输出纹波增大。
  • DCR:≈310 mΩ,较高的直流电阻意味着在高直流偏置下有明显的铜耗,应在热预算内评估功耗(例如:2 A 时 I^2·R ≈ 1.24 W)。

三、产品特点

  • 大电感量、适合低频滤波或中低频开关电源应用。
  • 封装紧凑(8.5×8.0 mm),便于表面贴装自动化组装。
  • 较高的饱和电流保证在瞬态或冲击电流下保持工作特性。
  • 结构稳健,适应一般工业温度与环境要求。

四、典型应用场景

  • 降压/升压 DC-DC 转换器的储能与滤波电感(适用于输出电流在 2 A 左右的方案)。
  • 电源输入滤波与 EMI 抑制,配合电容形成 LC 滤波网络。
  • LED 驱动器与小功率电机驱动的滤波与储能。
  • 功率管理模块、便携设备与工业控制板的电源子系统。

五、选型与设计建议

  • 若电路连续输出接近或超过 2 A,应评估温升与效率影响;DCR 较大时建议预留足够散热或选择更低 DCR 型号。
  • 峰值电流可能接近 Isat 时,应提升裕量或并联电感/使用更高 Isat 的器件以避免饱和。
  • 考虑纹波电流与电感值对输出电容与控制环路的影响,必要时做仿真与实际测量。
  • 对于高开关频率应用,需关注电感在工作频段的频率特性与损耗。

六、焊接与使用注意事项

  • 推荐遵循 J-STD-020 回流焊温度曲线进行焊接,避免超温或长时间高温。
  • PCB 布局时应保证充分的焊盘和散热铜箔,有利于降低 DCR 引起的局部升温。
  • 避免器件承受机械冲击或弯曲,应在贴片及清洗工艺中注意稳定固定。
  • 储存时避免潮湿、高温与强腐蚀性环境,必要时采用干燥包装并在规定时限内回潮焊接。

七、可靠性与测试

本型号适合通过常规的环境与电气应力测试(温度循环、湿热、机械冲击与振动)。在产品导入阶段建议进行温升、饱和特性、纹波电流耐受性与长期老化试验,以验证在目标应用中的稳定性与寿命。

总结:PSPMAA0803H-470M-ANP 为一款面向中等功率应用的高感量贴片功率电感,适合对感量与饱和电流有要求但对 DCR 有一定容忍度的电源设计。在选型与实际应用中,应综合考虑热耗、效率与电路动态性能,确保长期可靠运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.