WMSIC Electronic Components

PROD PSPNAQ252012-2R2M PSPNAQ252012

ModelPSPNAQ252012-2R2M
PackageSMD,2.5x2x1.2mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPNAQ252012-2R2M
Type
PROD
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPNAQ252012-2R2M
Electronic Component
1
Package
SMD,2.5x2x1.2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.054g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0264342835
Current
1.85A
Resistor(DCR)
158mΩ
Electronic Component
Electronic Component
Electronic Component
2000
and Current(Isat)
2.32A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPNAQ252012-2R2M功率电感产品概述

一、核心参数总览

PSPNAQ252012-2R2M是PROD(谱罗德)针对中低功率电路推出的小型化功率电感,核心参数精准匹配便携电子设备的电源管理需求:

  • 电感值与精度:标称2.2μH,精度±20%(符合工业级功率电感的常规设计裕量);
  • 电流特性:额定连续电流(Irms)1.85A(电感值变化≤10%的安全工作电流),饱和电流(Isat)2.32A(电感值下降30%的峰值电流极限);
  • 直流电阻(DCR):158mΩ(低导通损耗设计);
  • 封装形式:表面贴装(SMD),公制尺寸2.5mm×2.0mm×1.2mm(对应行业封装代码252012)。

二、封装与物理特性

该电感采用252012小型化SMD封装,是当前便携设备中空间优化的主流选择:

  1. 尺寸优势:2.5mm长×2.0mm宽×1.2mm高,相比传统1008封装(部分厂家定义)缩小约15%的体积,可适配PCB布局密集的场景(如智能手机主板的电源区域);
  2. 贴装兼容性:引脚设计符合IPC-A-610标准,支持260℃短期回流焊工艺,可与其他SMD元器件同步贴装,无需额外的工艺调整;
  3. 环境适应性:采用耐高温环氧树脂包封,具备抗振动(10G/20-2000Hz)、抗冲击(100G/0.5ms)能力,满足移动设备的跌落、震动测试要求。

三、电气性能详解

1. 电感值与精度

标称2.2μH±20%的电感值,覆盖了DC-DC转换器的常用范围(典型降压电路电感多在1μH~10μH之间)。±20%的精度无需额外的精密匹配,可通过反馈环路调整保证稳压精度,同时降低了元器件成本。

2. 电流特性

  • 额定电流(1.85A):是电感连续工作的安全上限,此时电感值变化≤10%,不会影响电路的纹波控制(如智能手机CPU供电的纹波要求≤50mV);
  • 饱和电流(2.32A):是峰值电流耐受极限,若负载峰值电流超过该值,电感磁芯饱和会导致电感值骤降,引发电路效率下降(如升压电路输出电压波动)。设计时需预留10%~20%裕量(即峰值电流≤2.09A)。

3. 直流电阻(158mΩ)

低DCR是该电感的核心优势:在1.85A额定电流下,导通损耗仅为0.54W(公式:P=I²×R),相比同尺寸200mΩ电感,损耗降低约20%,可有效减少电路发热,延长电池供电设备的续航时间(如智能手表单次充电续航提升5%~8%)。

四、应用场景定位

结合小型化、低损耗、电流裕量充足的特点,该电感主要适用于以下场景:

  1. 便携电子设备:智能手机、智能手表、蓝牙耳机的CPU供电DC-DC降压电路(如5V转3.3V/1.2V模块);
  2. 小型电源模块:USB-C快充适配器的辅助电源、物联网(IoT)设备的低功耗电源管理;
  3. LED驱动电路:小型LED台灯、车载氛围灯的恒流驱动(支持单路1.8A左右的负载);
  4. 消费电子配件:移动电源的升压电路、无线充电器的功率转换模块。

五、选型优势总结

  1. 空间效率高:252012封装可在单位PCB面积内集成更多电路,适合小型化产品的高密度设计;
  2. 性能均衡:电感值、电流特性、DCR三者匹配度高,无需在某一参数上妥协(如部分小型电感以高DCR换小尺寸);
  3. 成本可控:PROD谱罗德的量产工艺成熟,价格适中,适合中低端到中端消费电子的批量采购;
  4. 可靠性稳定:封装和电气参数经过实际应用验证,可满足3C产品5年以上的常规寿命要求。

该电感是便携电子设备电源管理的高性价比选择,兼顾小型化、低损耗与可靠性,可有效降低电路设计的复杂度与成本。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.