WMSIC Electronic Components

PROD PSCIAQ3225-110Z PSCIAQ3225

ModelPSCIAQ3225-110Z
PackageSMD-4P,3.2x2.5mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSCIAQ3225-110Z
Type
PROD
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSCIAQ3225-110Z
Electronic Component
1
Package
SMD-4P,3.2x2.5mm
Electronic Component
Common Mode Filter
Electronic Component
0.13g
Voltage
80V
Electronic Component
1
Channel Count
2
Electronic Component
BM0228679697
Operating Temperature
25℃~+105℃
Resistor
10MΩ
Voltage
80V
Current
300mA
Inductor@Frequency
11uH@100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSCIAQ3225-110Z 产品概述

一、概述

PSCIAQ3225-110Z为PROD(谱罗德)出品的一款小型表面贴装共模滤波器(Common Mode Choke),针对需要在窄空间内实现共模干扰抑制与EMI滤波的应用设计。器件采用SMD-4P封装,尺寸3.2×2.5mm,兼顾高频抑制性能与紧凑安装形态,适用于消费电子、通信与工业控制等领域。

二、主要参数

  • 型号:PSCIAQ3225-110Z
  • 品牌:PROD(谱罗德)
  • 封装:SMD-4P,尺寸3.2×2.5mm
  • 共模电感:11 µH @ 100 kHz
  • 额定电流:300 mA
  • 阻抗:500 Ω @ 10 MHz
  • 额定/耐压:80 V
  • 直流电阻(DCR):400 mΩ
  • 工作温度:-25 ℃ ~ +105 ℃
  • 绝缘电阻:10 MΩ

三、性能特点

  • 高频抑制能力强:10 MHz处阻抗500 Ω,适合抑制射频与开关噪声。
  • 紧凑体积:3.2×2.5mm SMD封装,利于高密度PCB布局。
  • 合理的直流电阻与额定电流:400 mΩ和300 mA的组合在保证滤波效率的同时,兼顾功耗与温升控制。
  • 额定电压与绝缘性能:80 V额定/耐压与10 MΩ绝缘电阻,满足多数低中压应用的可靠性需求。
  • 宽温区稳定性:-25 ℃~+105 ℃适应一般工业与消费环境。

四、典型应用

  • 手机与平板等便携设备的信号接口EMI抑制
  • HDMI、LVDS、CAM/ISP等高速差分线的共模噪声滤波
  • 工业控制、传感器接口与通信模块的干扰隔离
  • 电源相关小电流回路的共模滤波

五、布板与使用建议

  • 尽量靠近干扰源或连接器放置,共模滤波器位于噪声源与系统接地之间可获得最佳效果。
  • 两侧走线尽量长度一致,避免在器件之间放置过多过孔或互连,保持差分对对称性。
  • 避免长期满载工作,接近额定电流时可能出现电感下降(磁饱和)及温升,必要时预留裕度或并联处理。
  • 采用符合元件制造商推荐的回流焊工艺,控制焊接温度和时间以保证可靠性。

六、封装与可靠性

PSCIAQ3225-110Z为4引脚SMD器件,便于自动贴装与回流焊接。工作温度和绝缘等级适合大多数商用与工业场景,建议在设计阶段参照生产商提供的封装图与焊盘建议以优化可焊性与机械强度。

七、总结

PSCIAQ3225-110Z凭借11 µH的共模电感、在10 MHz处500 Ω的高频阻抗及小尺寸封装,为需要在有限空间内实现高效共模抑制的电路提供了一种实用方案。选型时建议结合实际工作电流、DC偏置与温升条件进行评估,以确保长期稳定工作。若需进一步的频率特性曲线或封装图纸,请联系供应商获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.