WMSIC Electronic Components

PROD PSPMAA1040H-330M-ANP PSPMAA1040H

ModelPSPMAA1040H-330M-ANP
PackageSMD,11x10mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA1040H-330M-ANP
Type
PROD
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA1040H-330M-ANP
Electronic Component
1
Package
SMD,11x10mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
2.828g
Inductor
33uH
Electronic Component
1
Electronic Component
BM0229259023
Current
4A
Resistor(DCR)
120mΩ
Electronic Component
Electronic Component
Electronic Component
800
and Current(Isat)
6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA1040H-330M-ANP 产品概述

一、产品简介

PSPMAA1040H-330M-ANP 是谱罗德(PROD)推出的一款贴片功率电感,标称电感值 33 μH,公差 ±20%,旨在中等功率开关电源与滤波应用中提供稳定的储能与电流平滑能力。产品采用 SMD 封装,外形尺寸约 11 × 10 mm,适配自动化贴装与回流焊工艺。

二、主要参数

  • 电感值:33 μH(±20%)
  • 额定电流(Ir):4 A(连续工作建议值)
  • 饱和电流(Isat):6 A(磁性材料在此电流时电感显著下降)
  • 直流电阻(DCR):120 mΩ
  • 封装:SMD,尺寸约 11 × 10 mm
  • 品牌:PROD(谱罗德)

三、关键性能与影响

  • 能耗与发热:DCR 为 0.12 Ω,在 4 A 时铜损约 P = I^2·R = 1.92 W,提示在近额定电流下器件发热显著,需通过散热设计或降低工作电流来控制温升。
  • 饱和特性:Isat = 6 A 表示能够承受短时突发电流,但超过额定 4 A 连续工作会接近饱和边界,导致电感值下降、输出纹波增大。
  • 频率适应性:适合几十 kHz 至数百 kHz 的开关频率场合,如降压转换器(buck)、电流滤波与储能回路。实际电感随频率和直流偏置电流会变化,应在目标工作点测量确认。

四、典型应用

  • 中小功率降压(Buck)开关电源的储能电感
  • 输入/输出滤波器,用于平滑电流与抑制射频干扰
  • LED 驱动、电机驱动与通信电源模块的能量存储与滤波
  • 工业/车载非关键子系统(需注意热管理与可靠性验证)

五、使用建议与注意事项

  • 工作电流选择:建议连续工作电流不超过额定 4 A;若有短时峰值,可容许接近 6 A,但须验证电感值下降对电路影响。
  • 散热与布局:鉴于较高的 DCR,建议在 PCB 上提供足够铜厚与散热面积,器件下方及周围铺铜并与散热层相连,减小温升。
  • 布线建议:将电感安放在靠近开关管/二极管的回路中,缩短高电流回路路径,确保电流回流低阻抗。
  • 焊接工艺:兼容常规 SMT 回流焊,请按 PCB 与无铅回流规范执行,回流曲线需避免过高的温度峰值以保障可靠性。
  • 验证测试:在目标环境(温度、频率、直流偏置)下测量电感、DCR 及温升,评估对系统效率与稳定性的影响。

六、封装与可靠性

SMD 封装、11 × 10 mm 的体积在同级别功率电感中兼顾了电流承载与磁芯体积。用于批量生产时常见包装形式为带卷盘(tape & reel),便于 SMT 贴装。建议在可靠性要求较高的场合做热循环、震动与高温贮存等可靠性验证。

七、选型提示

  • 若系统对效率与发热敏感,应优先考虑更低 DCR 或更大尺寸的电感以降低损耗。
  • 对于需要更高连续电流能力的场合,选择额定电流更高且饱和电流余量足够的型号。
  • 在替换或替代设计时,除了电感值和电流参数,还需关注 DCR、直流偏置特性与尺寸匹配,确保热与电性能满足系统要求。

总结:PSPMAA1040H-330M-ANP 以 33 μH、4 A 额定电流与 6 A 饱和电流定位中等功率储能/滤波场合,适用于对体积和自动贴装兼容性有要求的开关电源设计。在使用时需重视 DCR 带来的损耗与散热设计,并在目标工作条件下完成电磁与热性能验证。

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