WMSIC Electronic Components

PROD PSPMAA1265H-101M-ANF PSPMAA1265H

ModelPSPMAA1265H-101M-ANF
PackageSMD,12.8x13.2x6.5mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA1265H-101M-ANF
Type
SMD, 12.8X13.2X6.5MM
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA1265H-101M-ANF
Electronic Component
1
Package
SMD,12.8x13.2x6.5mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
6.67g
Inductor
100uH
Electronic Component
1
Electronic Component
BM0257629604
Current
4A
Resistor(DCR)
150mΩ
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA1265H-101M-ANF 产品概述

一、参数概述

PSPMAA1265H-101M-ANF 是谱罗德(PROD)推出的一款一体成型功率电感,适用于中等电流的开关电源和去耦滤波场合。主要电气和机械参数如下:

  • 标称电感值:100 μH(±20%)
  • 额定电流(Irated):4 A(连续工作)
  • 饱和电流(Isat):5 A(磁通密度导致电感显著下降时的参考值)
  • 直流电阻(DCR):150 mΩ
  • 封装与尺寸:SMD-2P,12.8 × 13.2 × 6.5 mm
  • 类型:一体成型(SMD功率电感)

以上参数用于元件选型与热/电设计的基准,请以厂家正式数据表为最终依据。

二、结构与电气特性

PSPMAA1265H-101M-ANF 采用一体成型结构,绕组与磁芯经过成型封装,便于表面贴装与自动化加工。一体成型结构通常具有以下特性:

  • 良好的机械强度和抗振性能,适合军工与工业环境的焊接与装配;
  • 相对稳定的漏磁与自感特性,但在直流偏置电流下电感值会下降,应关注饱和电流参数;
  • 较高的 DCR(150 mΩ)在高电流时会产生显著 I^2R 损耗(例如:在 4 A 时,近似铜损为 P = I^2·DCR = 16 × 0.15 ≈ 2.4 W),需在热设计中考虑散热与结温限制。

三、典型应用场景

  • DC-DC 降压/升压电源中的储能电感或滤波电感(尤其在中低开关频率场合)
  • 输入滤波/输出滤波以及电源噪声抑制
  • 工业控制、LED 驱动、电池管理和通信电源模块中对体积与电流有平衡需求的场合

四、设计与布局建议

为获得稳定性能与可靠寿命,建议在设计时注意以下要点:

  1. 电流裕量:额定电流 4 A 为连续工作参考,饱和电流 5 A 为极限值。设计时应留有裕量,避免长期工作接近 Isat,以防电感值下降与发热加剧。
  2. 热管理:由于 DCR 较大,建议在器件下方或近旁为电流回路设计足够铜箔面、热过孔或电源平面来分散热量;多层 PCB 可通过过孔与内层铜连接散热。
  3. 焊盘与焊接:按制造商封装图设计焊盘并保证焊盘面积与焊接量能承载额定电流;回流焊时遵循焊料与锡膏的推荐曲线,避免过热导致性能退化。
  4. 电磁兼容(EMC):若电路对磁场敏感,应在布局时考虑器件间距及屏蔽措施,减小漏磁对敏感器件的影响。

五、可靠性与存储

  • 一体成型封装具备较好机械强度,但仍需避免跌落、强冲击或超温存放;
  • 存储环境应干燥、无腐蚀性气体,避免长时间潮湿;若裸件暴露时间较长,建议采用干燥箱回潮处理后再进行回流焊;
  • 器件出厂品质需通过电感值、DCR 与外观检验,接收时请按来料检验标准核对批次与外观。

六、选型与检验建议

  • 在最终选型前,建议索取并查阅厂家完整数据手册,确认频率响应、温升曲线、耐焊性与封装图;
  • 进行样机测试:在实际工作电流与环境温度下测量电感随直流偏置的变化、温升以及热稳定性,验证是否满足系统要求;
  • 对于高可靠性方案,可考虑在额定电流下长期老化测试以评估寿命。

总结:PSPMAA1265H-101M-ANF 是面向中等电流应用的一体成型 SMD 功率电感,100 μH 的电感值适合低频开关电源和滤波用途。设计时应重点考虑直流损耗与散热管理,并参考厂方完整数据表与封装图进行 PCB 布局和可靠性验证。

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