WMSIC Electronic Components

PROD PSPMAA1265H-220M-ANF PSPMAA1265H

ModelPSPMAA1265H-220M-ANF
PackageSMD,12.8x13.2x6.5mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA1265H-220M-ANF
Type
PROD
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA1265H-220M-ANF
Electronic Component
1
Package
SMD,12.8x13.2x6.5mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
6.83g
Inductor
22uH
Electronic Component
1
Electronic Component
BM0258831980
Current
8A
Resistor(DCR)
36mΩ
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA1265H-220M-ANF 产品概述

一、产品简介

PSPMAA1265H-220M-ANF 为 PROD(谱罗德)系列一体成型功率电感,标称电感值 22 μH,公差 ±20%。器件为 SMD-2P 结构,外形尺寸 12.8 × 13.2 × 6.5 mm,适用于中大电流电源滤波与能量储存场合。该器件直流电阻(DCR)为 36 mΩ,额定电流 8 A,饱和电流 Isat 为 9 A,可满足高电流开关电源和点式负载的稳态与瞬态需求。

二、主要电气参数

  • 电感值:22 μH(±20%)
  • 额定电流:8 A
  • 饱和电流(Isat):9 A(规定饱和时电感显著下降)
  • 直流电阻(DCR):36 mΩ
  • 类型:一体成型功率电感(molded)
  • 封装:SMD,尺寸 12.8 × 13.2 × 6.5 mm
  • 型号:PSPMAA1265H-220M-ANF,品牌:PROD(谱罗德)

三、产品特性与优势

  • 低 DCR:36 mΩ 的直流电阻有助于降低 I^2R 损耗,提高转换效率,尤其在大电流场合能显著减少发热。
  • 高电流能力:8 A 额定电流与 9 A 饱和电流,保证在开关瞬态与启动冲击下仍有足够的电感量储能。
  • 一体成型结构:机械强度高,适合自动化贴装与焊接,抗振动性能良好。
  • 标准化封装:SMD 外形便于在高密度 PCB 上布局,尺寸适中,利于热管理与电磁兼容优化。

四、典型应用场景

  • 同步整流或非同步 DC-DC 降压转换器(电源输出滤波)
  • 多相电源模块与点式负载供电(POL)
  • LED 驱动与电池管理系统(BMS)前端滤波
  • 工业控制与通信设备中的功率滤波与能量储存

五、PCB 布局与安装建议

  • 贴片焊接时建议采用合适的焊盘尺寸并留有足够的焊锡过度,焊盘应加宽以降低接触电阻并利于热散。
  • 高频开关电路中,输入/输出电容应尽量靠近电感和开关器件放置,缩短回流环路以降低 EMI。
  • 对于高功率应用,建议在焊盘下或周围使用过孔接入内层或底层大铜面(via stitching)以增强散热能力。
  • 安装前遵循厂家推荐的回流焊温度曲线并进行首批焊接可焊性验证。

六、热管理与可靠性提示

  • 虽然 DCR 较低,但在高负载下仍会产生热量,建议在系统热分析中考虑器件温升并留有足够热裕量。
  • 对于长期大电流工作的方案,应留有电流余量(即工作电流低于额定电流),以避免接近饱和与过热。
  • 在极端环境(温度、振动、湿热)下使用前,建议进行实际工况的可靠性测试。

七、选型建议与注意事项

  • 若系统需要更小的电感偏差或更高饱和电流,应比较同系列或其他封装的器件参数后选型。
  • 在并联使用时注意均流与布局,尽量避免单独一只器件承受全部冲击电流。
  • 采购与库存时请确认完整的器件数据手册与规格书(包括回流焊曲线、封装图、热阻等),并与供应商确认批次与包装信息。

如需更详细的电气特性曲线、温升测试数据或参考设计图样,可提供具体应用场景,我可以帮您进一步优化选型和 PCB 布局建议。

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