Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PROD PCAQ3216B-222T025 PCAQ3216B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PROD PCAQ3216B-222T025
- Type
- PROD
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PROD
- Electronic Component
- PCAQ3216B-222T025
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- Common Mode Filter
- Electronic Component
- 0.068g
- Voltage
- 50V
- Electronic Component
- 1
- Channel Count
- 2
- Electronic Component
- BM0258741733
- Operating Temperature
- 25℃~+100℃
- Resistor
- 10MΩ
- Voltage
- 50V
- Current
- 250mA
- @Frequency
- 2.2kΩ@100MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCAQ3216B-222T025 产品概述
PCAQ3216B-222T025 为谱罗德（PROD）品牌的小尺寸共模滤波器，采用 1206（公制 3216）贴片封装，专为低电流、高抑制比的电磁干扰（EMI）抑制而设计。器件在 100 MHz 时表现出较高的共模阻抗，适用于信号线及低功率电源线对共模噪声的抑制与滤除，尤其适合空间与成本受限的消费电子、通信和工业控制应用。
一、主要参数
- 型号：PCAQ3216B-222T025
- 封装：1206（3.2 × 1.6 mm 级别贴片）
- 通道数：2（双通道/两线）
- 额定电流：250 mA（连续工作电流）
- 阻抗：2.2 kΩ @ 100 MHz（共模）
- 额定/耐电压：50 V
- 直流电阻 (DCR)：1.2 Ω（典型）
- 工作温度范围：-25 ℃ ~ +100 ℃
- 绝缘电阻：≥ 10 MΩ
二、产品特点
- 高共模阻抗：100 MHz 时 2.2 kΩ 的阻抗值，对射频段共模噪声有良好抑制效果。
- 低额定电流下的小尺寸封装：1206 封装适配高密度贴片电路板，适用于空间受限的场合。
- 可靠耐压与绝缘性能：50 V 耐压及 ≥10 MΩ 绝缘电阻，满足一般信号/低压电源线路绝缘要求。
- 宽工作温度：-25 ℃ 至 +100 ℃，适应常见工业与消费环境。
- 简易安装：表面贴装，兼容常规回流焊工艺，便于自动化生产线组装。
三、典型应用场景
- 手机、平板、可穿戴设备等消费电子的信号线或低功率电源线 EMI 抑制。
- 通信设备、路由器、基站小模块的射频干扰控制与滤波。
- 工业控制板、传感器模块中对共模干扰的抑制。
- USB、串口等接口线的共模噪声抑制（需确认电流与电压匹配）。
四、选型与使用建议
- 电流裕度：额定电流 250 mA 适合信号线与小电流供电场合；若电路工作电流较高，应选择更高额定电流型号。
- DCR 考虑：1.2 Ω 的直流电阻在某些敏感电源线上可能引入压降，使用前应评估对电源电压的影响。
- 温度与功率：工作温度接近上限时器件性能及额定电流可能需适当降额使用，以保证长期可靠性。
- 布线布局：为发挥最佳共模抑制效果，滤波器应尽量靠近干扰源或接口端放置，并保证良好接地布局以降低差模耦合。
- 焊接工艺：兼容标准回流焊流程，建议遵循制造商提供的焊接温度曲线以避免过热应力。
五、可靠性与质量检查要点
- 出厂检验应包含直流电阻、绝缘电阻及阻抗频率响应验证。
- 在应用中建议进行温升测试与长期老化验证，确认在实际工作条件下的稳定性。
- 对于关键应用场合，应进行抗振动、热循环与焊接可靠性试验以评估机械与热应力影响。
本文旨在提供 PCAQ3216B-222T025 的技术概览与工程使用参考。实际设计中请结合具体电路需求与 PCB 布局，必要时向供应商获取详细数据手册与样品以完成最终验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
