WMSIC Electronic Components

PROD PSPHAQ127-120M PSPHAQ127

ModelPSPHAQ127-120M
PackageSMD,12x12mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPHAQ127-120M
Type
PROD
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPHAQ127-120M
Electronic Component
1
Package
SMD,12x12mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
4.608g
Inductor
12uH
Electronic Component
1
Electronic Component
BM0257377687
Current
5.6A
Resistor(DCR)
24mΩ
Electronic Component
Electronic Component
Electronic Component
500
and Current(Isat)
5.6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPHAQ127-120M 产品概述

一、产品简介

PSPHAQ127-120M 是谱罗德(PROD)推出的一款 SMD 功率电感,封装尺寸 12×12mm,标称电感值 12 μH(公差 ±20%),额定电流 5.6 A,饱和电流(Isat)5.6 A,直流电阻(DCR)约 24 mΩ。该器件面向中高电流、要求体积紧凑的开关电源、电源滤波与能量储存场景,兼顾低损耗与较高饱和特性,适合自动贴装生产线。

二、主要特性

  • 电感值:12 μH,容差 ±20%
  • 额定电流:5.6 A(连续工作参考)
  • 饱和电流(Isat):5.6 A(在该电流点电感显著下降)
  • 典型 DCR:24 mΩ(参考 25°C)
  • 封装:SMD,外形尺寸 12 × 12 mm(便于高密度布板)
  • 适用于无铅回流焊工艺的 SMT 贴装

三、电气与热性能要点

  • 功率损耗估算:铜耗近似为 I^2 × DCR。例如在 5 A 时,损耗约为 5^2 × 0.024 ≈ 0.6 W。请结合散热条件评估温升。
  • 饱和特性:Isat = 5.6 A,接近额定电流。为避免工作点进入明显饱和区,建议在设计中留有余量(若允许更大电流波动,应进行实际电流-电感下降曲线验证)。
  • 直流偏置影响:在接入直流偏置电流时,电感会下降;对大电流应用应测量在工作电流下的实际电感值以确认滤波或储能性能。

四、典型应用场景

  • DC-DC 降压 / 升压转换器(中小功率至中高功率等级)
  • 输入/输出电源滤波器(去除开关噪声、抑制纹波)
  • 电池管理与电源模块中的能量储存元件
  • 工业供电、通信设备与车载电子(需评估环境与认证要求)

五、选型与使用建议

  • 电流余量:若系统允许,应将连续工作电流控制在额定电流以下并留出裕度(常见做法为 70%–90% 的额定电流,视散热条件与纹波幅度而定)。
  • 损耗与温升:以 I^2×DCR 估算铜损,并结合 PCB 铜箔和周围元件的散热能力计算温升;高温会进一步降低电感值并增加 DCR。
  • 纹波电流:考虑纹波电流对核心和铜损的影响,必要时进行仿真或实测。
  • 测量建议:用 LCR 表在目标频率(例如 100 kHz)和在实际直流偏置下测量电感;用恒流源 + LCR 或阻抗分析仪测量饱和曲线。

六、封装与焊接注意事项

  • 推荐按照厂家焊盘布局进行 PCB 设计,保证良好焊盘尺寸和锡量以实现可靠焊点与散热。
  • 建议采用推荐的回流焊曲线,避免过高的峰值温度和超时高温暴露以免影响磁芯性能。
  • 焊接后建议进行外观与电气测试,确认接触良好与 DCR、L 值符合要求。

七、可靠性与测试建议

  • 进行温度循环、潮湿热与振动测试以评估长期可靠性(视应用场景决定)。
  • 上电测试包括空载 L 值、在不同直流偏置下的 L-Id 曲线、DCR 测试以及在最大工作电流下的温升测试。
  • 对于关键应用,建议提供加速老化或批次抽样验证。

八、常见问题与解决措施

  • 出现电感下降或饱和:检查实际直流偏置是否接近或超过 Isat,改善设计电流余量或选用更大电感/更高饱和电流型号。
  • 温升过高:减少工作电流、改善 PCB 散热(加大铜箔、设置散热通孔)或选择更低 DCR 的型号。

九、订购与技术支持

型号:PSPHAQ127-120M,品牌:PROD(谱罗德)。订购时请确认批次信息与具体电气表征曲线(如 Id-L 曲线、频率相关的阻抗曲线)以满足最终应用需求。若需更详细的机械图纸、回流曲线或定制电性能,请联系供应商或技术支持获取完整资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.